Encapsulated Conformal Electronics Using Flexible Shells
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Solution Overview
Problem
Conventional integrated circuits (ICs) and printed circuit boards (PCBs) are rigid, making them incompatible with applications requiring stretchable or bendable electronics, and existing methods for embedding ICs in flexible substrates are costly and result in thick, undesirable composite structures.
Innovation Solution
The development of encapsulated conformal electronic systems with flexible and stretchable materials, such as soft elastomeric materials, that encase electronic circuitry within a flexible encapsulation layer, allowing for the creation of robust, durable, and versatile devices that can be molded or laminated for enhanced protection and compatibility with flexible substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional rigid ICs and PCBs are used, then structural strength and stability are improved, but flexibility and stretchability deteriorate
Solution Approach 1:
The patent applies flexible encapsulation layers (thin films) over rigid ICs to provide the necessary flexibility and stretchability. The encapsulation layer acts as a flexible shell that conforms to the rigid component while enabling the overall assembly to be bent and stretched without damaging the IC or PCB.
Solution Approach 2:
The patent creates a composite structure combining rigid ICs/PCBs with flexible encapsulation materials. This composite approach allows the system to maintain the structural strength of rigid components while gaining the flexibility and adaptability of soft materials, resolving the contradiction between strength and flexibility.
2Adaptability or versatility
If ICs are embedded in flexible substrates using conventional methods, then flexibility is improved, but device thickness increases
Solution Approach 1:
The patent uses thin film encapsulation layers to protect embedded ICs while maintaining overall device thinness. Instead of using thick protective housings or multiple rigid layers, the solution employs thin flexible films that provide protection and flexibility simultaneously without significantly increasing device thickness.
3Reliability
If multiple layers of expensive materials are used for flexible circuits, then reliability and protection are improved, but manufacturing cost and device thickness increase
Solution Approach 1:
The patent employs thin film encapsulation as a cost-effective alternative to multiple thick layers of expensive flexible circuit materials. The thin film provides adequate protection and reliability while reducing material costs and simplifying the manufacturing process.
Solution Approach 2:
The patent creates a composite structure using inexpensive flexible encapsulation materials combined with standard ICs and PCBs. This approach achieves reliable protection without requiring multiple layers of expensive specialized materials, thereby reducing manufacturing costs while maintaining or improving reliability.
Data Source
AI summary
Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.