Encapsulated Magnetic Core Inductor for Efficient Power Delivery

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Legacy inductors with air cores in substrate assemblies fail to meet the increasing power delivery efficiency requirements in advanced server architectures.

Innovation Solution

A substrate assembly with an encapsulated magnetic feature, where a magnetic core is integrated within the base substrate, allowing a portion of the coil to extend through the magnetic feature, enhancing the inductor's efficiency by using ferromagnetic materials and dielectric regions for improved magnetic permeability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If air core inductors are used in substrate assemblies, then the device structure remains simple, but the power delivery efficiency is insufficient

Engineering Contradiction:
Improvepower delivery efficiencyVSAvoidinductor structure complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The magnetic feature is encapsulated within the base substrate, with the coil extending through the magnetic feature. This nested configuration integrates the magnetic core inside the substrate structure, creating a compact inductor that improves power delivery efficiency while maintaining a space-efficient design suitable for advanced server architectures

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The inductor combines ferromagnetic materials for the magnetic feature with dielectric regions and conductive coil materials. This composite material approach enhances the magnetic permeability and overall efficiency of the inductor, resolving the contradiction between energy efficiency and structural simplicity by integrating multiple functional materials into a unified structure

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If magnetic features are encapsulated within the base substrate, then the inductor efficiency is improved, but the manufacturing process complexity increases

Engineering Contradiction:
Improveinductor efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The magnetic feature is formed within the base substrate before the coil is constructed. This preliminary action allows the magnetic core to be pre-positioned and encapsulated, simplifying subsequent coil formation processes and enabling more efficient manufacturing despite the enhanced inductor efficiency achieved through the magnetic feature

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The magnetic feature, dielectric regions, and coil structures are merged into a single integrated inductor assembly. This consolidation reduces the number of separate manufacturing steps and assembly operations, thereby improving ease of manufacture while maintaining the high efficiency benefits of the encapsulated magnetic feature

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides greater efficiency for power delivery inductors, surpassing the limitations of air core inductors by utilizing a magnetic core that enhances the inductor's performance in substrate assemblies.

Implementation Method 1

A substrate assembly with an encapsulated magnetic feature, where a magnetic core is integrated within the base substrate, allowing a portion of the coil to extend through the magnetic feature, enhancing the inductor's efficiency by using ferromagnetic materials and dielectric regions for improved magnetic permeability

Methodology Applied
Scientific EffectFerromagnetism: Ferromagnetism

Data Source

PatentUS11901115B2Substrate assembly with encapsulated magnetic feature
Publication Date: 2024.02.13 INTEL CORP
  • US11901115B2 patent drawing
  • US11901115B2 patent drawing
  • US11901115B2 patent drawing

AI summary

Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.