Encapsulated Electronic Yarns for Wearable Durability
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Solution Overview
Problem
Existing yarns with electronic devices and electrical connections face exposure risks due to surface placement, compromising their functionality and durability, especially when integrated into fabric products.
Innovation Solution
A yarn design featuring a core of carrier fibers with mounted electronic devices and conductive interconnects, surrounded by packing fibers and a retaining sleeve, which encases the core, devices, and interconnects to protect them from external factors and maintain a uniform cross-section, using materials like polybenzimidazole fibers and fine copper wire for thermal stability and bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electronic devices and electrical connections are placed on the yarn surface, then the yarn structure remains simple, but the electrical connections are exposed and compromised by contact with other yarns or external conditions
Solution Approach 1:
The patent implements a nested protective structure where the core contains electronic devices, which are then enclosed by packing fibres, and finally the entire assembly is surrounded by a retaining sleeve. This multi-layer nesting approach protects electrical connections while maintaining a manageable yarn structure.
Solution Approach 2:
The yarn is divided into distinct functional segments: a core for electronic devices, a middle layer of packing fibres, and an outer retaining sleeve. This segmentation allows each layer to perform its specific protective function while contributing to the overall yarn structure.
2Reliability
If a protective structure is added around electronic devices and interconnects, then the reliability of electrical connections is improved, but the manufacturing complexity increases
Solution Approach 1:
Electronic devices and interconnects are mounted on the core before the packing fibres and retaining sleeve are added. This preliminary assembly allows the protective structure to be built around pre-positioned components, simplifying the overall manufacturing process.
Solution Approach 2:
The packing fibres act as an intermediary layer between the electronic devices on the core and the outer retaining sleeve. This intermediate layer facilitates the manufacturing process by providing a buffer zone for assembly and positioning.
3Shape
If packing fibres are used to fill spaces between devices, then the yarn maintains a uniform cross-section, but the device complexity and processing steps increase
Solution Approach 1:
Packing fibres are selectively placed in specific locations - around the core and in spaces between devices - rather than uniformly throughout. This localized application maintains the uniform cross-section where needed while avoiding unnecessary complexity in other areas.
Data Source
Figure 1~5
Figure 2~6
Figure 3~4
AI summary
An electronically functional yarn comprises a plurality of carrier fibres (6) forming a core with a series of electronic devices (2) mounted on the core with conductive interconnects (8) extending from the devices along the core. A plurality of packing fibres (10) extend around the core, the devices and the interconnects, and are selectively bunched or twisted to fill spaces between the devices, which packing fibres preserve a substantially uniform cross-section along the length of the yarn and between the devices. The packing fibres are enclosed within a retaining sleeve (12) around the packing fibres, and the core, the devices and the interconnects are confined within the plurality of packing fibres retained in the sleeve.