Encapsulated Filtered Feedthrough for Implantable Devices
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Solution Overview
Problem
Existing filtered feedthrough assemblies in implantable medical devices face issues with high voltage capacitors in confined spaces, leading to dielectric breakdown and arcing due to concentrated electrical fields, which can result in therapy delivery failures.
Innovation Solution
Encapsulating high voltage capacitors with non-conductive materials to provide dielectric isolation and increase the voltage breakdown threshold, allowing for tighter spacing and smaller device designs while mitigating electric field compression issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high voltage capacitors are densely packaged in confined spaces, then device size is reduced, but dielectric breakdown and arcing occur due to concentrated electrical fields
Solution Approach 1:
A dielectric material is introduced as an intermediary substance between high voltage capacitors in confined spaces. This mediator increases the voltage breakdown threshold and prevents arcing while allowing the capacitors to maintain tight spacing, thus resolving the contradiction between small device size and dielectric breakdown resistance
Solution Approach 2:
The dielectric properties of the space between capacitors are changed by introducing a material with higher dielectric strength than air. This parameter change increases the voltage breakdown threshold, allowing tight spacing without sacrificing reliability against dielectric breakdown
2Volume of moving object
If air gaps are minimized for tighter spacing, then device size is reduced, but electrical field intensity increases leading to breakdown
Solution Approach 1:
The electrical properties of the gap medium are changed from air to a dielectric material with higher breakdown voltage. This allows minimal spacing without the harmful effect of intense electrical fields causing breakdown, as the dielectric material can withstand higher field intensities
Solution Approach 2:
A dielectric material serves as an intermediary in the gap between capacitors, replacing air. This mediator reduces the harmful electrical field intensity effects by providing higher dielectric strength, enabling tight spacing without breakdown
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulated filtered feedthrough assemblies effectively protect against high electric field breakdowns, ensuring reliable therapy delivery by minimizing air gaps and increasing the dielectric isolation, thus preventing failures associated with electric field compression in confined spaces.
Implementation Method 1
Encapsulating the capacitors with non-conductive materials can provide an encapsulated filtered feedthrough assembly that provides a high degree of dielectric isolation and can mitigate the high electric field breakdown issues associated with electric field compression in confined spaces
Data Source
AI summary
An encapsulated filtered feedthrough assembly for an implantable medical device including a ferrule, an electrical insulator coupled to the ferrule, a printed circuit board (PCB), a feedthrough conductor extending through the electrical insulator and the PCB, and a capacitor coupled to the PCB. The encapsulated filtered feedthrough assembly can include a mold defining an opening and located with respect to the printed circuit board such that at least a portion of the capacitor is positioned within the opening. A first non-conductive material can underfill the capacitor and a second non-conductive material can be backfilled into the mold to encapsulate the capacitor.