Encapsulated Laminate Package for Low-Inductance Thermal Management
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Solution Overview
Problem
Conventional electronic packaging solutions face challenges in achieving high reliability, performance, and flexibility due to limitations in thermal management, electrical insulation, and mechanical protection, particularly in high-power applications where wire bonding is cumbersome and prone to errors, and stray inductance is high.
Innovation Solution
A package design featuring a thermally conductive and electrically insulating carrier with a laminate structure, where an electronic component is encapsulated between the carrier and the laminate, providing efficient heat removal, electrical insulation, and mechanical protection, while reducing stray inductance through antiparallel electric connection paths and eliminating the need for wire bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connections, then electrical connectivity is achieved, but device complexity and manufacturing effort increase
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the packaging system. Electrical connections are achieved directly through conductive paths within the laminate structure and carrier board, removing the need for separate wire bonding operations and reducing manufacturing complexity while maintaining electrical connectivity
Solution Approach 2:
The patent merges the electrical connection function with the structural laminate and carrier board. Conductive traces are integrated directly into the laminate layers and carrier board, combining mechanical support and electrical connectivity into unified structures rather than separate components
2Reliability
If conventional packaging structures are used, then mechanical protection is provided, but thermal management efficiency is insufficient
Solution Approach 1:
The patent segments the packaging structure into distinct functional layers: the laminate provides mechanical protection and electrical routing, while the carrier board with its thermally conductive substrate and heat sink handles thermal management. This segmentation allows each component to optimize its specific function without compromising the other
Solution Approach 2:
The patent employs composite material structures, particularly the carrier board combining a thermally conductive substrate (such as aluminum nitride or beryllium oxide ceramic) with a metal heat sink. This composite approach achieves high thermal conductivity while maintaining mechanical strength and electrical insulation where needed
3Volume of moving object
If compact packaging is implemented, then space is reduced, but electrical insulation and thermal management become more challenging
Solution Approach 1:
The patent utilizes vertical layering and three-dimensional integration within the laminate structure. Electrical traces are routed through multiple laminate layers with insulating material between them, allowing compact horizontal footprint while maintaining adequate electrical insulation distances through the vertical dimension
Solution Approach 2:
The patent introduces the carrier board as an intermediary structure between the laminate and the heat sink. This carrier board provides both electrical insulation (through its substrate material) and thermal conduction (through its thermally conductive properties), mediating between the electrical components in the laminate and the thermal management system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal, electrical, and mechanical reliability, reduces manufacturing effort, and improves switching speed by integrating components within the laminate-carrier architecture, offering high performance and flexibility for various applications.
Implementation Method 1
a carrier (102) comprising a thermally conductive and electrically insulating layer (104)
Implementation Method 2
a carrier (102) comprising a thermally conductive and electrically insulating layer (104)
Implementation Method 3
an encapsulant (112) being at least partially arranged between the carrier (102) and the laminate (106) and encapsulating at least part of the electronic component (110)
Data Source
AI summary
A package is disclosed. In one example, the package comprises a carrier comprising a thermally conductive and electrically insulating layer, a laminate comprising a plurality of connected laminate layers, an electronic component mounted between the carrier and the laminate. An encapsulant is at least partially arranged between the carrier and the laminate and encapsulating at least part of the electronic component.