Encapsulated Leadframe Packages With Copper-Poor Sawing Paths
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The packaging industry faces challenges in reducing processing complexity while maintaining high device reliability, particularly in manufacturing encapsulated electronic components with efficient resource usage and minimal material waste.
Innovation Solution
A package design featuring a carrier with an encapsulant and leads, where the encapsulant has sawn and punched surfaces, and a leadframe concept with carriers arranged in rows and columns, allowing for efficient encapsulation and singularization through copper-poor sawing and punching processes, reducing material usage and increasing manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If conventional encapsulation and singularization processes are used, then manufacturing complexity is reduced, but material waste increases and resource usage efficiency decreases
Solution Approach 1:
The encapsulant is divided into multiple individual encapsulants that can be separately formed for each carrier, allowing precise material usage and reducing waste. Each encapsulant is molded independently around its carrier and electronic component, enabling selective material application without excess.
Solution Approach 2:
The leadframe is prepared in advance with carriers arranged in rows and columns, and leads are pre-positioned before encapsulation. This preliminary arrangement allows for optimized encapsulation molding and subsequent efficient singularization by sawing, reducing overall processing complexity and material waste.
2Productivity
If high-speed sawing is used for singularization, then productivity increases, but metal usage increases due to copper-poor sawing trajectory
Solution Approach 1:
The sawing trajectory is optimized to create a copper-poor cut path, concentrating metal removal in areas with minimal leadframe material. The saw blade follows a predetermined path that avoids excessive metal engagement, enabling high-speed cutting while minimizing metal usage and heat generation.
3Manufacturing precision
If leads are punched from encapsulant, then manufacturing precision is improved, but processing time increases
Solution Approach 1:
The leads are pre-formed and positioned on the leadframe before encapsulation. The punching process then only needs to separate the leads from the encapsulant along pre-defined trajectories, rather than forming leads from scratch. This preliminary positioning significantly reduces processing time while maintaining precision.
4Productivity
If multiple carriers are encapsulated together, then productivity increases, but device complexity increases due to common encapsulant structure
Solution Approach 1:
The common encapsulant structure is designed with internal segmentation features that allow it to be divided into individual encapsulants after molding. The encapsulant material is formulated and structured to facilitate clean separation along predetermined lines, enabling efficient multi-carrier encapsulation followed by easy singularization without excessive complexity.
Data Source
AI summary
A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.