Encapsulated Metal Particles for Polymer Thermal Conductivity

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Solution Overview

Problem

Current polymers have poor thermal and radio frequency (RF) conductivity while being electrically insulating, and existing solutions like diamond or beryllium oxide are either too expensive or pose health risks, necessitating a cost-effective and safe method to enhance conductivity.

Innovation Solution

Encapsulated metal particles with a metallic core coated in a glass shell are used to increase thermal and RF conductivity in polymers, maintaining electrical insulation, with particle sizes between 3 μm to 20 μm for optimal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If diamond particulates are added to polymers to enhance thermal conductivity, then thermal conductivity is improved, but manufacturing cost becomes prohibitively expensive

Engineering Contradiction:
Improvethermal conductivityVSAvoidmanufacturing cost
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter from diamond to metal core particles, fundamentally altering the thermal conductivity mechanism while reducing cost. Metal particles provide high thermal conductivity through free electron movement, replacing the phonon-based conduction in diamond, thus achieving similar thermal performance at lower manufacturing cost

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent creates a composite structure with metal core and glass shell, combining the high thermal conductivity of metal with the electrical insulation and safety of glass. This composite approach resolves the contradiction by achieving thermal conductivity enhancement without the prohibitive cost of diamond while maintaining electrical insulation properties

Inventive Principle:
Principle #40Composite materials

2Temperature

If beryllium oxide is used as a filler material to improve thermal conductivity, then thermal conductivity is enhanced, but health risks arise due to carcinogenic dust and chronic beryllium disease

Engineering Contradiction:
Improvethermal conductivityVSAvoidhealth risks
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces hazardous long-term materials like beryllium oxide with safer metal particles that pose no health risks. The metal cores are encapsulated to ensure safety during processing and use, eliminating the health hazards associated with beryllium dust while maintaining thermal conductivity benefits

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The glass shell acts as an intermediary between the metal core and the external environment, providing electrical insulation and safety protection. This mediator allows the metal particles to provide thermal conductivity while the glass shell ensures safety by preventing direct exposure to metal particles and maintaining electrical insulation

Inventive Principle:
Principle #24Intermediary (Mediator)

3Temperature

If filler materials are added to improve thermal conductivity, then thermal conductivity is enhanced, but electrical insulation properties are compromised due to inherent conductivity of fillers like graphite or powdered metal

Engineering Contradiction:
Improvethermal conductivityVSAvoidelectrical insulation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent segments the filler material into two distinct functional components: the metal core provides thermal conductivity while the glass shell provides electrical insulation. This segmentation allows each component to perform its specific function independently, resolving the contradiction between thermal conductivity enhancement and electrical insulation maintenance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The encapsulated metal particles form a composite material where the metal core and glass shell work together synergistically. The metal core enhances thermal conductivity while the glass shell maintains electrical insulation, creating a composite filler that simultaneously achieves both thermal performance and electrical insulation properties

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulated metal particles significantly enhance thermal and RF conductivity of polymers by up to several orders of magnitude, making them suitable for various applications including high-performance battery cells, lightweight heatsinks, and energy harvesting systems without compromising electrical insulation.

Implementation Method 1

the core comprises a metallic substance... increase its thermal conductivity

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

increase its thermal conductivity and/or radio frequency (RF) conductivity

Methodology Applied
Scientific EffectElectromagnetic conduction: Conduction (electrical)

Implementation Method 3

the shell... comprises glass... retain the inherent electrical insulating properties of the polymer

Methodology Applied
Scientific EffectElectrical insulation: Dielectric

Data Source

PatentUS20230141354A1Encapsulated particles
Publication Date: 2023.05.11 GOODWIN PLC
  • US20230141354A1 patent drawing

AI summary

The invention relates to an encapsulated metal particle comprising a core encapsulated in a shell, wherein the core comprises a metallic substance, and wherein the shell comprises a insulating substance. The invention also relates to a polymer composition comprising a plurality of the encapsulated metal particles, a mixture comprising a plurality of encapsulated metal particles and plurality of polymer particles, and the use of the encapsulated metal particle as an additive for increasing the thermal conductivity and/or radio frequency (RF) conductivity of a matrix substance such as an adhesive.