Encapsulated Electronics Module With Through-Plating for Heat Control

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Solution Overview

Problem

Existing electronic modules face challenges in managing thermally induced mechanical stresses and heat dissipation, particularly with new components like WBG semiconductors, which require improved design and switching behavior for enhanced service life.

Innovation Solution

An electronic module design featuring a carrier substrate partially embedded in an encapsulation with through-plating for direct electrical connections between components, utilizing a second metallization layer on the encapsulation's outer side and vias to maintain compactness and minimize heat interference, along with a thermomechanically symmetrical structure for reduced thermal expansion.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic components are arranged on a carrier substrate and embedded in an encapsulation, then the module achieves compactness and protection, but thermally induced mechanical stresses increase and heat dissipation becomes difficult

Engineering Contradiction:

Improvemodule compactnessVSAvoidheat dissipation

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent introduces a vertical through-plating dimension through the encapsulation, allowing electrical and thermal connections to extend from the component side to the opposite side of the module. This third-dimensional approach enables heat dissipation pathways that do not compromise the compact horizontal arrangement of components on the carrier substrate.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The module is segmented into distinct functional zones: the carrier substrate area for component mounting, the encapsulation volume for protection and insulation, and the through-plating pathways for thermal and electrical management. This segmentation allows each zone to optimize its specific function without interfering with others.

Inventive Principle:

Principle #1Segmentation

2Device complexity

If a common carrier substrate is used for all components, then device complexity is reduced, but control precision and switching behavior deteriorate

Engineering Contradiction:

Improvesubstrate structureVSAvoidswitching behavior

Core Design Contradiction:

Device complexityVSManufacturing precision

Solution Approach 1:

The patent applies different material properties and structural characteristics to different regions of the carrier substrate. The first metallization layer is optimized for power handling with higher current capacity, while the second metallization layer is optimized for control signals with lower impedance. This local differentiation enables precise control of switching behavior while maintaining overall structural simplicity.

Inventive Principle:

Principle #3Local quality

3Reliability

If through-plating is added for direct electrical connection, then parasitic inductance is reduced and control is improved, but manufacturing complexity increases

Engineering Contradiction:

Improvecontrol stabilityVSAvoidproduction process

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The through-plating is integrated into the encapsulation manufacturing process itself, rather than being added as a separate post-processing step. The encapsulation material is applied with pre-formed through-plating structures already in place, allowing subsequent component mounting and wire bonding to proceed without additional complex manufacturing operations.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances operational reliability and service life by minimizing heat interference and thermally induced stresses, while allowing efficient heat dissipation and reduced parasitic inductances, thus improving control and stability of electronic components.

Implementation Method 1

the through-plating (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and of the second electronic component (31)

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

thermomechanically symmetrical structure for reduced thermal expansion

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 3

heat generated on the component side can be dissipated as optimally as possible, preferably by means of a cooling structure provided for this purpose

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12575440B2Electronics module and method for producing it

Publication Date: 2026.03.10 ROGERS GERMANY

AI summary

Electronic module (1) includingan encapsulation (20),a carrier substrate (10) enclosed by the encapsulation (20) and having a component side (25) which has a first metallization layer (15) and on which at least one first electronic component (30) is arranged,wherein at least one second metallization layer (35) for at least one second electronic component (31), in particular for controlling the first electronic component (30), is provided on an outer side (A) of the encapsulation (2),wherein the encapsulation (20) has at least one plated-through hole (5) for electrical connection, in particular for direct electrical connection, of the first electronic component (30) and the second electronic component (31).