Encapsulated Package Antenna Dielectric Waveguide Interference

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Solution Overview

Problem

Dielectric waveguides face interference issues due to external conductive objects and lack of isolation, especially at high frequencies where signal lines can act as antennas, leading to signal radiation and power loss.

Innovation Solution

Embedding an antenna structure within an encapsulated molded package with a dielectric constant matching the waveguide core, using nanoparticles like TiO2 or BaTiO3 to enhance the dielectric constant of the mold compound, and optimizing the antenna's placement and interconnects to minimize impedance mismatch and maximize coupling with the dielectric waveguide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a dielectric waveguide is used for high frequency signal transmission, then signal transmission capability is improved, but electromagnetic interference from external conductive objects increases

Engineering Contradiction:
Improvesignal transmission capabilityVSAvoidelectromagnetic interference
Core Design Contradiction:
SpeedVSObject-affected harmful factors

Solution Approach 1:

The patent applies a metallic shield surrounding the dielectric waveguide, forming a protective barrier that blocks external electromagnetic interference while allowing the waveguide to maintain its flexible dielectric core structure. This shield acts as a protective shell that isolates the waveguide from harmful external fields.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The metallic shield serves as an intermediary element between the external environment and the dielectric waveguide. It mediates the interaction by absorbing or reflecting electromagnetic interference before it reaches the waveguide, while allowing the desired signal transmission to proceed through the dielectric core.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If signal lines are used at high frequencies, then data transmission rate is improved, but signal radiation and power loss increase

Engineering Contradiction:
Improvedata transmission rateVSAvoidpower loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The metallic shield surrounding the dielectric waveguide prevents signal radiation by containing the electromagnetic fields within the waveguide structure. This eliminates energy loss through radiation while allowing high-frequency signals to transmit efficiently through the dielectric core.

Inventive Principle:
Principle #30Flexible shells and thin films

Solution Approach 2:

The patent employs a composite structure combining a dielectric core material with a metallic shielding layer. This composite design leverages the high dielectric constant material for efficient signal propagation while the metallic layer provides containment, reducing power loss and preventing unwanted radiation.

Inventive Principle:
Principle #40Composite materials

3Reliability

If an antenna structure is embedded in the encapsulation material, then coupling with dielectric waveguide is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvesignal coupling efficiencyVSAvoidmanufacturing complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the antenna structure with the encapsulation molding process, embedding the antenna directly into the mold compound during encapsulation. This integration eliminates separate assembly steps and reduces manufacturing complexity while achieving reliable coupling between the antenna and dielectric waveguide.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The encapsulation material serves multiple functions: it provides mechanical protection, electrical insulation, and acts as the embedding medium for the antenna structure. This multi-functionality reduces the need for additional components and simplifies the overall manufacturing process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces electromagnetic interference, enhances signal coupling efficiency, and maintains power transmission over long distances by matching the dielectric properties of the encapsulation material with the waveguide core, thereby improving the reliability of high-frequency signal transmission.

Implementation Method 1

Propagation in a dielectric waveguide may be viewed in the same way, with the waves confined to the dielectric by total internal reflection at its surface.

Methodology Applied
Scientific EffectTotal internal reflection: Total Internal Reflection

Implementation Method 2

When a dielectric is placed in an electric field, electric charges do not flow through the material as they do in a conductor, but only slightly shift from their average equilibrium positions causing dielectric polarization. This creates an internal electric field which reduces the overall field within the dielectric itself.

Methodology Applied
Scientific EffectDielectric polarization: Polarisation

Implementation Method 3

Permittivity is a material property that expresses a measure of the energy storage per unit meter of a material due to electric polarization (J/V^2)/(m). Relative permittivity is the factor by which the electric field between the charges is decreased or increased relative to vacuum.

Methodology Applied
Scientific EffectPermittivity: Dielectric Permittivity

Data Source

PatentUS9647329B2Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
Publication Date: 2017.05.09 TEXAS INSTRUMENTS INC
  • US9647329B2 patent drawing
  • US9647329B2 patent drawing
  • US9647329B2 patent drawing

AI summary

An encapsulated integrated circuit has transceiver circuitry operable to produce and/or receive a radio frequency (RF) signal, wherein bond pads on the IC die are coupled to the transceiver input/output (IO) circuitry. An antenna structure is coupled to the IO circuitry via the bond pads. Mold material encapsulates the IC die and the antenna structure, wherein the antenna structure is positioned so as to be approximately in alignment with a core of a dielectric waveguide positioned adjacent the encapsulated IC.