Encapsulated Semiconductor Package With Reinforcement for Compact Wearables
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Solution Overview
Problem
The integration of additional electronic components in smartwatches, such as GPS and heart rate sensors, increases the size and weight of the housing, negatively impacting user experience.
Innovation Solution
A semiconductor device package with a reinforced structure surrounded by an encapsulation layer, which eliminates the need for a housing by distributing electronic components, including a display device, power device, and electronic components, within the encapsulation layer, providing protection and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional electronic components (GPS module, heart rate sensing module) are integrated into the housing, then the functionality of the smartwatch is improved, but the size and weight of the housing increase
Solution Approach 1:
The patent merges the electronic components (display device, power device, and other functional modules) into a single integrated semiconductor device package. The encapsulation layer encapsulates all these components together with the reinforced structure, creating one unified component that provides multiple functions (display, power management, sensing) without requiring separate housings for each component.
Solution Approach 2:
The patent implements a nested structure where the reinforced structure is placed inside the encapsulation layer, and all electronic components are arranged within the compact semiconductor device package. This nested arrangement allows multiple components to occupy overlapping or adjacent spaces efficiently, maximizing space utilization and minimizing the overall package dimensions.
2Adaptability or versatility
If additional electronic components are integrated into the housing, then the functionality of the smartwatch is improved, but the size of the housing increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement of components to a three-dimensional stacked configuration. The display device, power device, and other components are arranged in multiple layers within the semiconductor device package, utilizing vertical space to reduce the horizontal footprint and overall package area.
Solution Approach 2:
The patent merges the electronic components (display device, power device, and other functional modules) into a single integrated semiconductor device package. The encapsulation layer encapsulates all these components together with the reinforced structure, creating one unified component that provides multiple functions (display, power management, sensing) without requiring separate housings for each component.
3Reliability
If a reinforced structure is added to protect electronic components, then the reliability of the device is improved, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent merges the reinforced structure integration into the encapsulation process. The reinforced structure is placed within the encapsulation layer during the same manufacturing step, eliminating the need for separate reinforcement installation steps and reducing overall manufacturing complexity despite adding structural protection.
Solution Approach 2:
The encapsulation layer serves dual functions: it provides electrical insulation and packaging for the electronic components while simultaneously housing the reinforced structure for mechanical protection. This self-service approach consolidates multiple protective functions into a single component, simplifying the overall device architecture.
Data Source
AI summary
A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.