Encapsulated PCB Temperature Sensor Layout Without Connector Blocks
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Solution Overview
Problem
Existing sensor arrangements are inefficient and costly due to the use of connector blocks and lack of flexibility in adapting to customer-specific requirements, leading to suboptimal performance and increased complexity.
Innovation Solution
A sensor arrangement utilizing a double-sided printed circuit board with adaptable shape and thickness, integrated sensor devices directly connected to solder pads via vias, and encapsulated with insulation, eliminating intermediate components and enhancing protection and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connector blocks are used in existing sensor arrangements, then electrical connection is established, but device complexity and cost increase
Solution Approach 1:
The patent removes the connector block (intermediate component) from the electrical connection path. The sensor device is now directly soldered to the circuit board via solder pads, eliminating the connector block and reducing device complexity while maintaining reliable electrical connection.
Solution Approach 2:
The patent merges the electrical connection function directly into the circuit board by providing solder pads on the circuit board itself. This combines the functions of the circuit board and connector block into a single integrated structure, eliminating the need for separate connector components.
2Measurement precision
If existing sensor arrangements are used, then temperature measurement is achieved, but adaptability to customer requirements is limited
Solution Approach 1:
The patent makes the sensor arrangement adaptable by allowing flexible configuration of the circuit board shape, thickness, and solder pad arrangement. These parameters can be dynamically adjusted to meet different customer requirements while maintaining the core temperature measurement function.
Solution Approach 2:
The patent enables adaptability by changing key parameters such as circuit board shape, thickness, and solder pad positions according to customer-specific requirements. The sensor device can be configured with different parameters without changing the fundamental measurement principle.
3Reliability
If existing sensor arrangements are used, then sensor device is connected to circuit board, but production cost and complexity increase
Solution Approach 1:
The patent removes the connector block from the assembly, eliminating the need to manufacture, inventory, and assemble this intermediate component. This directly reduces production cost and simplifies the manufacturing process while maintaining reliable electrical connection.
Solution Approach 2:
The patent combines the electrical connection function into the circuit board itself through solder pads, eliminating the need for separate connector components. This integration reduces the number of parts to manufacture and assemble, lowering production cost and complexity.
4Ease of operation
If sensor device is exposed without insulation, then accessibility is maintained, but environmental protection is reduced
Solution Approach 1:
The patent uses an insulating material that forms a protective layer around the sensor device. This thin film or shell provides environmental protection while maintaining the necessary electrical insulation and thermal conductivity for temperature measurement.
Solution Approach 2:
The patent employs insulating materials that provide both mechanical protection and electrical insulation properties. The composite structure of the insulating material protects the sensor device from external influences while allowing the temperature measurement function to operate effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, compact, and user-friendly sensor arrangement with improved accuracy and simplified production, adaptable to various applications by eliminating intermediate components and enhancing environmental protection.
Implementation Method 1
The sensor device comprises a temperature dependent electrical resistance
Implementation Method 2
The insulation envelops at least the sensor device on the top side of the circuit board completely. The sensor device is overmolded by the insulation.
Data Source
AI summary
In an embodiment a sensor arrangement for measuring a temperature includes at least one double-sided printed circuit board, wherein the circuit board has a top side and a bottom side, at least one first solder pad and at least one second solder pad being arranged on the top side and on the bottom side, respectively, at least one sensor device mechanically and electrically connected directly to the top side of the circuit board, and an insulation enveloping at least the sensor device on the top side of the circuit board completely.