Encapsulated Phase Change Material Thermal Interface for Skin Temperature Reduction
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Solution Overview
Problem
Conventional thermal management solutions for electronic devices often lead to elevated skin temperatures during use, causing user discomfort due to the redirection of hot air from semiconductor packages towards the device's interior, despite the use of cooling components.
Innovation Solution
A composition comprising encapsulated phase change material particles dispersed within a matrix, applied to conductive substrates or heat spreading devices, which absorbs heat and provides both thermal conductivity and EMI shielding, effectively managing heat dissipation and reducing skin temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional thermal management solutions (heat sinks, heat pipes, fans) are used to dissipate heat from semiconductor packages, then heat dissipation performance is improved, but skin temperature increases causing user discomfort
Solution Approach 1:
The patent introduces a thermal interface material as an intermediary substance between the semiconductor package and the heat sink. This TIM contains phase change material particles dispersed in a matrix, which actively absorbs and stores heat through phase change, preventing direct thermal conduction to the heat sink while maintaining effective heat management. This mediator approach resolves the contradiction by decoupling the heat dissipation function from the skin temperature constraint.
Solution Approach 2:
The patent utilizes phase change material particles that undergo phase transition (e.g., solid-liquid) to absorb and store thermal energy. The phase change process occurs at specific temperatures, allowing the material to absorb heat during phase transition without significant temperature increase. This phase transition mechanism enables effective heat dissipation while maintaining low skin temperature, directly resolving the technical contradiction.
2Stability of the object's composition
If graphite heat spreaders are used to distribute heat evenly, then thermal insulation through thickness is improved, but skin temperature remains elevated due to heat redirection toward interior
Solution Approach 1:
The patent employs a composite thermal interface material consisting of phase change material particles dispersed within a matrix material. This composite structure combines the thermal insulation properties of the matrix with the phase change heat absorption capabilities of the particles. The composite material provides both thermal insulation through thickness and active heat management, preventing the skin temperature elevation caused by conventional graphite spreaders.
3Productivity
If semiconductor chip size is reduced and computing capacity is increased, then device performance is improved, but operating temperature increases
Solution Approach 1:
The patent applies the thermal interface material with phase change material particles to replicate and extend the thermal management capabilities across the semiconductor package surface. The material copies the heat dissipation function but adds the phase change heat storage capability, allowing higher computing capacity in reduced-size chips to operate at lower temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces skin temperatures by absorbing heat and enhancing thermal conductivity, providing a comfortable user experience while maintaining the performance of electronic devices.
Implementation Method 1
encapsulated phase change material particles dispersed within a matrix, which absorbs heat
Implementation Method 2
The composition is capable of absorbing heat. As such, in use it may be disposed onto at least a portion of a surface of a heat spreading device constructed from conductive materials
Data Source
AI summary
Provided herein are compositions made from a matrix and encapsulated phase change material particles dispersed therein, and electronic devices assembled therewith.