Encapsulated Pin Through-Hole Carrier for Reliable Dense Interconnects
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Solution Overview
Problem
Conventional approaches to forming component carriers face challenges in achieving mechanical robustness and electrical reliability, especially under harsh conditions, due to difficulties in forming reliable connections with small spacing and high aspect ratio through holes.
Innovation Solution
A component carrier is designed with an inorganic carrier having through holes that contain pre-formed, at least partially conductive pins directly encapsulated by an electrically insulating layer structure, ensuring reliable electrical and thermal connectivity while minimizing manufacturing complexity and warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional approaches are used to form through holes and connections in component carriers, then manufacturing processes can be simplified, but mechanical robustness and electrical reliability deteriorate under harsh conditions
Solution Approach 1:
Conductive pins are pre-formed and inserted into through holes before the insulating layer structure is applied. This preliminary action ensures proper positioning and reduces the complexity of subsequent manufacturing steps while maintaining reliable electrical connections under harsh conditions.
Solution Approach 2:
The component carrier uses a composite structure combining conductive pins, insulating layer structure, and through holes. This composite design provides both mechanical robustness and electrical reliability by integrating materials with complementary properties - the conductive pins provide electrical connectivity while the insulating layer provides mechanical support and electrical isolation.
2Productivity
If through holes with small spacing and high aspect ratio are formed to accommodate more components, then device density increases, but connection reliability and manufacturing ease worsen
Solution Approach 1:
Conductive pins are pre-formed with precise dimensions and inserted into through holes before final assembly. This preliminary preparation ensures that even with small spacing and high aspect ratios, the pins are correctly positioned and oriented, maintaining connection reliability while enabling higher device density.
Solution Approach 2:
The invention optimizes parameters such as pin diameter, pin length, and through hole dimensions to achieve the right balance between device density and connection reliability. By carefully controlling these parameters, the design accommodates more components per unit area while ensuring robust electrical connections even in high-aspect-ratio through holes.
3Ease of manufacture
If pins are inserted in through holes without direct encapsulation, then manufacturing steps are reduced, but electrical stability and mechanical strength deteriorate
Solution Approach 1:
The insulating layer structure serves multiple functions simultaneously: it provides electrical insulation, mechanically anchors the conductive pins through direct encapsulation, and contributes to the overall structural integrity of the component carrier. This merging of functions eliminates the need for separate anchoring steps while maintaining manufacturing efficiency.
Solution Approach 2:
The direct encapsulation of conductive pins by the insulating layer structure creates a composite interface that combines the mechanical properties of the insulating material with the electrical conductivity of the pins. This composite structure provides both the necessary mechanical strength for robust connections and the electrical insulation required for stable operation, all within a single integrated layer.
Data Source
AI summary
A component carrier and a method of manufacturing the component carrier are presented. A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure, an inorganic carrier provided as part of the stack, a through hole in the inorganic carrier extending between a first main surface and a second main surface, and at least one at least partially conductive pin in the through hole, wherein the at least one at least partially conductive pin is directly encapsulated in the through hole by encapsulating material of at least one electrically insulating layer structure of the stack.