Encapsulated Sensor Chips in Polymer Coatings for Continuous Monitoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current technologies lack effective methods for continuous monitoring of environmental conditions, such as tremors in Parkinson's disease patients and carbon monoxide levels, using embedded sensors in a user-friendly and reliable manner.
Innovation Solution
Integration of semiconductor devices, sensors, and communication elements into a polymer-based solution like nail lacquer, allowing for the detection and monitoring of environmental conditions through encapsulated electronic circuits that transmit data wirelessly for analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors and electronic circuits are integrated into polymer-based coatings, then continuous monitoring capability is improved, but device complexity increases
Solution Approach 1:
The patent combines sensors, electronic circuits, and communication elements into a single integrated electronic circuit that is then dispersed into the polymer coating. This merging of multiple functional components into one unified system enables continuous monitoring while managing complexity through integration rather than separate components.
Solution Approach 2:
The electronic circuit is encapsulated within an insulator, which is then dispersed into the polymer coating. This nested structure allows the complex electronic components to be contained within a simplified outer form that can be easily applied as a coating, resolving the contradiction between monitoring capability and device complexity.
2Ease of operation
If encapsulated circuits are dispersed into lacquer solution, then ease of application is improved, but manufacturing precision deteriorates
Solution Approach 1:
The patent changes the physical state and distribution parameters of the electronic circuit by dispersing encapsulated circuits into the lacquer solution. This allows the circuits to be uniformly distributed throughout the coating material, enabling easy application while maintaining functional integrity through controlled dispersion parameters.
Solution Approach 2:
The lacquer solution acts as an intermediary medium that carries the encapsulated electronic circuits during application. This intermediary allows the circuits to be applied easily as a coating while the encapsulation protects the precision of the electronic components from damage during the application process.
3Ease of operation
If sensors are embedded in polymer coatings, then user-friendliness is improved, but reliability deteriorates due to potential damage to electronic components
Solution Approach 1:
The electronic circuit is nested within an insulator encapsulation, which provides protective layers around the sensitive electronic components. This nested structure allows the sensors to be embedded in the polymer coating for user-friendliness while the encapsulation protects the reliability of the electronic components from environmental damage.
Solution Approach 2:
The insulator encapsulation serves as an intermediary protective layer between the electronic components and the external environment. This intermediary protects the reliable operation of sensors while allowing them to be integrated into the user-friendly polymer coating application.
Data Source
AI summary
Systems, methods, and electronic circuits facilitating embedded sensor chips in polymer-based coatings are provided. In one example, a method comprises fabricating an electronic circuit, the electronic circuit comprising one or more semiconductor devices, one or more sensors, and a communication element; encapsulating the electronic circuit within an insulator, resulting in an encapsulated circuit; and dispersing the encapsulated circuit into a lacquer solution comprising a polymer carrier and a solvent.