Encapsulated Sensor Module for Air Quality Measurement
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Solution Overview
Problem
Conventional sensor modules for air quality measurement are often large, sensitive to mechanical damage, difficult to install, require multiple chambers, and can provide imprecise measurements due to enclosed volumes and outgassing issues.
Innovation Solution
A compact sensor module with a printed circuit board and housing, encapsulated with a filling compound, featuring a robust housing made of materials like PA or PP, and a fastening device with a seal to attach to ducts or containers, eliminating the need for measuring chambers and reducing mechanical vulnerability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional sensor arrangements use multiple chambers for measuring different air parameters, then measurement capability is improved, but device complexity and size increase
Solution Approach 1:
The patent combines multiple sensors (temperature sensor, humidity sensor, particle counter, gas sensor) onto a single printed circuit board, eliminating the need for multiple separate chambers. This integration maintains comprehensive measurement capability while significantly reducing device complexity and size.
Solution Approach 2:
The printed circuit board serves as a multi-functional platform that hosts various types of sensors simultaneously. The housing structure provides universal support and protection for all sensor components, allowing the device to measure multiple air parameters (temperature, humidity, particles, gases) through a unified design.
2Reliability
If conventional sensor modules use enclosed measuring chambers, then sensor protection is improved, but measurement precision deteriorates due to outgassing and sluggish response
Solution Approach 1:
The patent extracts the sensors from enclosed measuring chambers and places them directly on the printed circuit board exposed to the environment. This eliminates the outgassing problem and sluggish response associated with enclosed chambers, while the housing and sealing compounds provide necessary protection against mechanical damage and contamination.
Solution Approach 2:
The housing structure implements local quality by providing selective protection: the housing body and sealing compounds protect the printed circuit board and electronic components from mechanical damage and moisture, while the sensor areas remain exposed to the environment for accurate measurement. This localized approach to protection maintains both sensor protection and measurement precision.
3Strength
If sensor modules are made robust with strong housing materials, then mechanical strength is improved, but manufacturing complexity increases
Solution Approach 1:
The patent uses composite material construction with a housing made from strong materials (PA, PBT, ABS, or PP) combined with sealing compounds (silicone rubber, polyurethane, or hot melt adhesives). This composite approach provides robust mechanical strength while using well-established manufacturing processes for both the housing and sealing components, maintaining ease of manufacture.
Solution Approach 2:
The sealing compounds are applied in advance to the housing or printed circuit board before final assembly. This preliminary action ensures proper sealing and mechanical protection are built into the structure during manufacturing, rather than requiring complex post-assembly operations, thus maintaining manufacturing simplicity while achieving robust construction.
4Measurement precision
If multiple individual sensors are used in conventional arrangements, then measurement accuracy is improved, but ease of installation deteriorates
Solution Approach 1:
The patent merges multiple individual sensors (temperature, humidity, particle counter, gas sensor) onto a single printed circuit board that is pre-assembled and tested as one unit. This integration maintains the measurement accuracy of individual sensors while dramatically simplifying installation, as the entire multi-sensor assembly can be installed as a single module rather than requiring separate installation of multiple sensors and their interconnections.
Data Source
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AI summary
A sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board (20) and at least one sensor (21, 22, 23) on the printed circuit board (20) for acquiring a measured parameter of the fluid, in particular the surrounding air, wherein at least a portion of the printed circuit board (20), with the exception of a recess for the at least one sensor (21, 22, 23), is encapsulated with a filler material (201). Furthermore, a housing (10) for the printed circuit board (20) is provided, as well as a mounting device (12) for attaching the sensor module to a wall (9) of a channel or container for the fluid or to a support for the sensor module. A seal (122) is applied to the mounting device (12), wherein the seal (122) is a hot melt, a UV-curable material, or a casting compound.