Package Structure With Encapsulated TIM to Prevent Liquid Metal Leakage
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Solution Overview
Problem
The challenge in designing and packaging electronic devices that process large amounts of data at high speeds is the prevention of liquid metal thermal interface material (TIM) leakage, which occurs due to warpage changes in the package structure, leading to inadequate thermal dissipation and reliability issues.
Innovation Solution
A package structure is proposed that includes a package substrate, an electronic device, a thermal interface material (TIM) with a larger lateral dimension than the electronic device, a lid, and an insulating encapsulant. The TIM is designed with a protruding portion that extends into the encapsulant to prevent leakage and ensure proper coverage, while the lid and encapsulant enhance adhesion and thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal TIM is used to improve thermal dissipation performance, then thermal dissipation performance is improved, but TIM leakage occurs due to warpage changes
Solution Approach 1:
The patent introduces an encapsulant as an intermediary substance that fills the space between the TIM and the external environment. This encapsulant prevents direct leakage of the liquid metal TIM while maintaining thermal contact, thus resolving the contradiction between improving thermal dissipation and preventing TIM leakage.
Solution Approach 2:
The patent employs the encapsulant as a flexible containment structure that can accommodate warpage changes in the package. This flexible enclosure allows the TIM to maintain thermal contact with the heat source while preventing leakage, thus resolving the contradiction between thermal performance and leakage prevention.
2Area of stationary object
If TIM lateral dimension is increased to ensure coverage, then coverage is improved, but TIM leakage risk increases
Solution Approach 1:
The encapsulant acts as a mediator that contains the extended TIM, allowing it to spread laterally for better coverage while preventing it from leaking out of the package structure. This resolves the contradiction between needing large coverage area and preventing leakage.
3Reliability
If package structure is made more complex to prevent TIM leakage, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The encapsulant serves multiple functions simultaneously: it provides mechanical support, prevents TIM leakage, facilitates thermal conduction, and accommodates warpage changes. This multi-functionality reduces the need for additional specialized components, thus improving reliability without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents liquid metal TIM leakage, improves the reliability of the package structure, and enhances dissipating thermal performance by ensuring consistent coverage and adhesion of the TIM and lid within the encapsulant.
Implementation Method 1
Liquid metal thermal interface material (TIM) is a kind of high dissipating thermal performance material that can be utilized on a lid type package to improve dissipating thermal performance
Data Source
AI summary
A package structure is provided. The package structure comprises a package substrate, an electronic device, a thermal interface material (TIM), a lid and an insulating encapsulant. The electronic device is disposed on and electrically connected to the package substrate. The TIM is disposed on the electronic device. The lid is disposed on the TIM. The insulating encapsulant is disposed on the package substrate and laterally encapsulates the electronic device and the TIM. A lateral dimension of the TIM is greater than a lateral dimension of the electronic device.