Encapsulating Composition for Organic Electronics
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are sensitive to moisture and oxygen, leading to durability issues and electromagnetic interference due to the oxidation of organic materials and metal electrodes, which affects their lifespan and performance.
Innovation Solution
An encapsulating composition comprising an epoxy compound, an oxetane compound, and a photoinitiator, applied via an inkjet method, forms a thin, low-dielectric constant organic layer that seals the entire surface of the device, preventing moisture and oxygen ingress while minimizing electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a passivation layer is formed by repeatedly laminating an organic layer and an inorganic layer, then moisture and oxygen blocking is improved, but the device thickness increases and electromagnetic field interference occurs
Solution Approach 1:
The patent applies a thin organic encapsulation layer (few nanometers to sub-10 nm thickness) that functions as a flexible barrier film to block moisture and oxygen penetration. This thin film approach provides effective environmental protection while maintaining device thinness, avoiding the thickness increase associated with multiple laminated layers.
Solution Approach 2:
The patent employs composite encapsulation structures combining organic encapsulation layers with inorganic layers (such as Alq3, BCP, TPBi, TCTA, TAPC, or mCP). This composite material approach achieves superior moisture and oxygen blocking performance compared to single-material layers, while maintaining thin overall thickness and reducing electromagnetic interference.
2Length of stationary object
If the organic layer is made thinner to reduce device thickness, then device thinning is improved, but electromagnetic field interference increases
Solution Approach 1:
The patent uses composite encapsulation layers combining organic materials with specific inorganic materials that have low dielectric constants. This composite structure maintains thin overall thickness while the specific material composition reduces electromagnetic field interference, solving both the thinning requirement and the EMI problem simultaneously.
Solution Approach 2:
The patent changes the dielectric constant parameter of the encapsulation layer by selecting specific organic materials (such as Alq3, BCP, TPBi, TCTA, TAPC, or mCP) with inherently low dielectric constants. This parameter optimization reduces electromagnetic field interference while maintaining the thin layer structure needed for device thinning.
3Reliability
If conventional encapsulation methods are used, then moisture blocking is improved, but manufacturing complexity and process difficulty increase
Solution Approach 1:
The patent replaces mechanical lamination processes with solution-based deposition methods. The organic encapsulation layer is formed by depositing a solution containing the encapsulation material, which is then cured to form the final layer. This substitution simplifies manufacturing by eliminating complex mechanical lamination steps while achieving effective moisture blocking.
Solution Approach 2:
The patent utilizes phase transition during the curing process of the encapsulation layer. The material transitions from a liquid solution state to a solid cured state, forming the final encapsulation layer. This phase transition approach simplifies manufacturing by allowing direct deposition from solution followed by curing, avoiding complex multi-step lamination processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulating composition effectively extends the lifespan of organic electronic devices by blocking external moisture and oxygen, enabling top-emitting designs and reducing electromagnetic interference, while allowing for thin displays and efficient inkjet processing.
Implementation Method 1
An encapsulating composition comprising an epoxy compound, an oxetane compound, and a photoinitiator
Data Source
AI summary
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, can implement a top-emitting organic electronic device, can be applied in an inkjet method, can provide a thin display and can effectively prevent interference of an electromagnetic field due to a low dielectric constant.