Encapsulating Composition for Thin Organic Electronics
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Solution Overview
Problem
Conventional organic electronic devices face challenges in manufacturing thin devices due to thick organic layers, which lead to inter-circuit interference and require an encapsulating composition that can effectively block moisture and oxygen while maintaining excellent spreadability and hardness.
Innovation Solution
An encapsulating composition comprising an aliphatic carbobicycle compound, epoxy compounds with cyclic structures, and oxetane groups, combined with a photoinitiator and surfactant, is applied using inkjet printing to form a thin, moisture-barrier organic layer with low dielectric constant, preventing inter-circuit interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the organic layer is made thick to prevent inter-circuit interference, then circuit interference is reduced, but the device thickness increases making it difficult to manufacture thin devices
Solution Approach 1:
The patent changes the dielectric constant parameter of the encapsulating composition to be 3.5 or less, which is significantly lower than conventional materials. This parameter change allows the organic layer to be made thinner while maintaining the same level of inter-circuit interference protection, as the low dielectric constant material provides better electrical isolation per unit thickness.
Solution Approach 2:
The patent uses a composite encapsulating composition containing aliphatic carbobicycle compounds (which provide low dielectric constant), epoxy compounds (which provide adhesion and protection), and oxetane groups (which enhance crosslinking and mechanical properties). This composite material achieves both low dielectric constant for interference prevention and sufficient mechanical strength for device protection.
2Length of stationary object
If the organic layer is made thin to reduce device thickness, then thin device manufacturing is enabled, but inter-circuit interference occurs
Solution Approach 1:
By reducing the dielectric constant parameter to 3.5 or less, the patent enables the organic layer to provide sufficient electrical isolation at reduced thickness. The low dielectric constant minimizes capacitive coupling between circuits, allowing thin layer design without sacrificing interference protection.
Solution Approach 2:
The patent applies low dielectric constant material specifically in the encapsulating composition where electrical isolation is critical, while other layers can have different properties. This localized optimization of dielectric constant in the encapsulating layer provides interference protection without requiring the entire device structure to be redesigned.
3Ease of manufacture
If the encapsulating composition is made to have excellent spreadability for thin layer formation, then thin device manufacturing is enabled, but the hardness of the cured product may be reduced
Solution Approach 1:
The patent combines aliphatic carbobicycle compounds (providing low dielectric constant and spreadability), epoxy compounds (providing adhesion and cured hardness), and oxetane groups (providing crosslinking density and mechanical strength). The epoxy and oxetane components ensure the cured product maintains sufficient hardness even when the layer is thin and the composition is designed for good spreadability.
Solution Approach 2:
The patent optimizes the molecular weight and functional group content of the aliphatic carbobicycle compound to achieve the right balance between spreadability (lower viscosity) and cured hardness (sufficient crosslinking density). By controlling these parameters, the composition can be applied as a thin layer while still forming a hard, durable cured product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulating composition effectively blocks moisture and oxygen, allows for thin organic electronic device manufacturing without inter-circuit interference, and achieves excellent hardness and spreadability, enabling the production of durable and efficient thin organic electronic devices.
Implementation Method 1
an encapsulating composition for sealing an organic electronic element applicable to an inkjet printing process
Implementation Method 2
can effectively block moisture or oxygen introduced into an organic electronic device from the outside
Data Source
AI summary
The present application provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside, and has excellent spreadability, is applicable to thin organic electronic devices and has excellent hardness of the cured product after curing, without causing an inter-circuit interference problem.