One-Piece Encapsulating Packaging Cushion for Electronic Devices
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Solution Overview
Problem
Existing packaging systems for electronic devices are inefficient and costly, often requiring multi-step processes, using excessive materials, and failing to protect all sides of the product during shipping, while also being wasteful and environmentally harmful.
Innovation Solution
A one-piece packaging cushion that fully or partially encapsulates products using a void cavity and translated surface, providing variable compression to secure items of varying sizes, made from moldable foam materials like polyethylene or polypropylene, which can be easily manufactured and reused.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two-piece packaging cushions are used to protect electronic devices, then protection coverage is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple cushioning functions into a single integrated one-piece packaging cushion. The cushion includes a base portion and a raised portion that work together as one unit to protect electronic devices from all sides, eliminating the need for separate bottom cushions and top cushions that would need to be assembled together.
Solution Approach 2:
The one-piece packaging cushion is designed to perform multiple protective functions simultaneously. It provides shock absorption, impact protection, and secure positioning for electronic devices of various sizes through its integrated structure with a base portion and a raised portion, making it a universal solution for different product dimensions.
2Reliability
If specialty packaging materials are designed for particular products, then protection effectiveness is improved, but manufacturing cost and waste increase
Solution Approach 1:
The packaging cushion is designed as a universal solution that can accommodate electronic devices of various sizes and dimensions. The base portion and raised portion can be configured in different dimensions while maintaining the same fundamental structure, allowing a single mold design to produce cushions for multiple product types without requiring specialized materials for each product.
Solution Approach 2:
The invention allows for parameter variations in the cushion dimensions while maintaining the same basic structure. The base portion and raised portion can be manufactured in different sizes and configurations using the same mold design, enabling scalability across different product lines without increasing manufacturing complexity or waste.
3Reliability
If complete end caps or top and bottom trays of foam are used, then protection coverage is improved, but material waste and cost increase
Solution Approach 1:
The invention extracts only the necessary amount of foam material required for effective protection. Instead of using complete end caps or full top and bottom trays, the design uses a base portion with a raised portion that provides targeted cushioning exactly where needed, removing excess material while maintaining adequate protection coverage.
Solution Approach 2:
The packaging cushion applies different densities or configurations of foam material in different locations based on protection needs. The raised portion provides enhanced cushioning for the top surface of the device, while the base portion provides support for the bottom, optimizing material distribution to match the actual protection requirements of electronic devices.
4Manufacturing precision
If molded plastics or polystyrene blocks are used for specific products, then protection precision is improved, but adaptability and recyclability worsen
Solution Approach 1:
The one-piece packaging cushion with its base portion and raised portion design creates a universal fit for electronic devices of various sizes. The modular structure allows the same cushion design to accommodate different product dimensions, improving adaptability and reusability compared to highly customized molded plastics designed for single specific products.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively protects all sides of electronic devices during shipping, reduces material waste, and offers a scalable, cost-effective, and environmentally friendly packaging solution that can accommodate various product sizes without the need for multiple molds or complex manufacturing processes.
Implementation Method 1
The packaging cushion can be made of any moldable foam material, such as molded polyethylene or polypropylene
Implementation Method 2
The translated surface provides compression against the product utilizing a variable compression top cushion to securely hold varied depth products within
Data Source
AI summary
A packaging cushion is provided which has a bottom cushion piece, first and second side cushion pieces, a front cushion piece, a rear cushion piece, and a translated top cushion piece. The bottom cushion piece defines a void cavity and front entry portion. The first side cushion piece may be substantially perpendicular to the bottom cushion piece, and the second side cushion piece may be substantially perpendicular to the bottom cushion piece and opposite the first side cushion piece. The front cushion piece may be substantially perpendicular to the bottom cushion piece and may define an entry space adjacent to the front entry portion. The rear cushion piece may be substantially perpendicular to the bottom cushion piece and opposite the front cushion piece. The translated top cushion piece extends from the rear cushion piece and is displaced from the void cavity. The packaging cushion at least partially covers six sides of a product housed therein. Methods of packaging products and methods of manufacturing a one-piece encapsulating packaging cushion using a male mold and a female mold are also provided.