Encapsulating Layer Vibration Treatment for OLED Moisture Barrier

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Solution Overview

Problem

Organic electronic devices, particularly OLEDs, face durability issues due to sensitivity to moisture and oxygen, leading to encapsulation challenges that affect the reliability and efficiency of the encapsulating process.

Innovation Solution

A method involving vibration treatment of ink compositions during ink-jet printing to form a flat and reliable encapsulating layer, combined with specific ink composition formulations including epoxy compounds and oxetane groups, to effectively block moisture and oxygen, while minimizing nozzle clogging and out-gas issues.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If inkjet printing is used to apply encapsulating composition, then productivity is improved, but manufacturing precision deteriorates due to nozzle clogging and line omission stains

Engineering Contradiction:

Improveencapsulation process efficiencyVSAvoidpattern flatness and completeness

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent applies ultrasonic vibration (20-100 kHz) to the inkjet printing system to prevent nozzle clogging and ensure complete ink deposition. The vibration disrupts ink viscosity and prevents aggregation, eliminating line omission stains while maintaining pattern flatness and encapsulation quality

Inventive Principle:

Principle #18Mechanical vibration

Solution Approach 2:

The patent modifies printing parameters including ink composition (adding solvents like ethanol or water), printing speed, and vibration frequency to optimize the balance between productivity and precision. By adjusting these parameters, the system achieves high-speed printing without sacrificing pattern completeness or flatness

Inventive Principle:

Principle #35Parameter changes

2Reliability

If encapsulating layer is formed to block moisture and oxygen, then reliability is improved, but device complexity increases

Engineering Contradiction:

Improveendurance reliability against moisture and oxygenVSAvoidencapsulation structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses composite encapsulating compositions containing epoxy compounds, oxetane compounds, and inorganic fillers (such as aluminum oxide or silicon oxide). This composite structure provides superior moisture and oxygen barrier properties while maintaining a relatively simple single-layer encapsulation structure

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent employs thin-film encapsulation technology to create a compact protective layer that effectively blocks moisture and oxygen penetration. The thin film structure maintains device simplicity while providing high reliability through multiple molecular layers that prevent contaminant diffusion

Inventive Principle:

Principle #30Flexible shells and thin films

3Manufacturing precision

If vibration treatment is applied to ink composition, then manufacturing precision is improved, but use of energy increases

Engineering Contradiction:

Improvepattern flatnessVSAvoidvibration energy consumption

Core Design Contradiction:

Manufacturing precisionVSUse of energy by moving object

Solution Approach 1:

The patent applies periodic ultrasonic vibration only during the critical ink deposition phase rather than continuously. This intermittent vibration approach maintains pattern flatness and prevents defects while minimizing energy consumption by activating the vibration system only when needed for ink placement

Inventive Principle:

Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances the endurance reliability of the encapsulating layer, prevents defects like line omission stains and microbubbles, and increases process efficiency by ensuring excellent flatness and moisture barrier properties.

Implementation Method 1

capable of effectively blocking penetration of moisture or oxygen from the outside into the organic electronic device

Methodology Applied

Scientific EffectPermeation barrier: Permeation

Implementation Method 2

By applying vibration to the ink composition applied on the element, the present application can form an encapsulating layer having excellent flatness

Methodology Applied

Scientific EffectUltrasonic vibration: Ultrasonic Vibration

Implementation Method 3

The ink composition may comprise an epoxy compound and a compound having an oxetane group

Methodology Applied

Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentEP3683854B1Method for encapsulating organic electronic element

Publication Date: 2024.11.27 LG CHEM LTD

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AI summary

A method for encapsulating an organic electronic element and an organic electronic device is provided. The method for encapsulating the organic electronic element is capable of effectively blocking moisture or oxygen introduced from the outside to an organic electronic device, is excellent in flatness of an encapsulating layer to have excellent endurance reliability, and increases efficiency of an encapsulating process.