Encapsulation Method for Environmentally Sensitive Electronic Elements
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional encapsulation methods for flexible environmentally sensitive electronic elements face challenges in alignment accuracy and reliability due to imprecise alignment and adhesive issues during the fabrication process, affecting yield and product reliability.
Innovation Solution
An encapsulation method that improves alignment precision by using alignment marks on both substrates and disposing cover lids in limiting cavities, with a pre-cured adhesive and sealants, allowing for precise lamination and separation, thereby enhancing yield and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive tape is used to fasten cover lid holder and cover lid, then assembly is simplified, but alignment accuracy deteriorates during mass production
Solution Approach 1:
The invention divides the encapsulation process into two independent stages: first bonding the cover lid to the substrate using adhesive tape (simplified assembly), then bonding the cover lid holder to the substrate with precise alignment marks (high precision alignment). This segmentation allows each stage to optimize for its specific requirement without compromise.
Solution Approach 2:
The invention performs preliminary bonding of the cover lid to the substrate before the final assembly with the cover lid holder. This preliminary action establishes a stable base that facilitates subsequent precise alignment and bonding operations, ensuring both ease of manufacture and manufacturing precision.
2Strength
If heating process is applied during fabrication, then bonding is enhanced, but adhesive tape loses adhesiveness
Solution Approach 1:
The invention performs the adhesive tape bonding operation before the heating process is applied. By completing the adhesive bonding in advance, the tape is protected from thermal degradation, maintaining its adhesiveness throughout the fabrication process while still achieving strong bonding.
Solution Approach 2:
The invention protects the adhesive tape from the harmful effects of heating by completing its bonding function before the heat is applied. This beforehand cushioning approach prevents the adhesive from losing its properties, ensuring reliable bonding throughout the fabrication process.
3Ease of operation
If alignment marks are used on substrate holder and cover lid holder, then alignment process is simplified, but alignment accuracy deteriorates due to placement variations
Solution Approach 1:
The invention introduces the substrate as an intermediary element that carries alignment marks directly on its surface. This intermediary provides a stable reference frame that combines the simplicity of mark-based alignment with the precision needed for mass production, as the substrate's position is fixed relative to both the holder and the cover lid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances alignment accuracy, increases fabrication yield, and improves product reliability by preventing incomplete separation and adhesive residue issues, facilitating mass production while reducing fabrication costs.
Implementation Method 1
An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive
Data Source
AI summary
An encapsulation method of an environmentally sensitive electronic element is provided. A first substrate is provided, wherein at least one first alignment mark and a plurality of environmentally sensitive electronic elements are formed on the first substrate. A second substrate is provided, wherein at least one second alignment mark and a plurality of limiting cavities are formed on the second substrate. A plurality of cover lids is respectively disposed in the limiting cavities. An adhesive is formed on the cover lids. The first substrate and the second substrate are laminated together with the first alignment mark and the second alignment mark as reference, so that the environmentally sensitive electronic elements are sealed in the adhesive and located between the first substrate and the second substrate. The second substrate and the cover lids are separated from each other.