Encapsulation Layer with Air Spaces for Sensor Sensitivity
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Solution Overview
Problem
Existing electronic devices with light emitting elements face challenges in protecting these elements from foreign substances and in reducing noise due to the permittivity of encapsulation layers, which affects the sensitivity of sensor layers.
Innovation Solution
The electronic device incorporates a layered structure with a light emitting element layer, a first encapsulation layer, a second encapsulation layer defining spaces, a mask pattern layer with openings, and a third encapsulation layer, where the spaces are sealed and air or vacuum is accommodated within, reducing the permittivity and enhancing sensor layer sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional encapsulation layer is used to protect light emitting elements, then protection from foreign substances is achieved, but noise interference increases due to high permittivity of the encapsulation layer
Solution Approach 1:
The encapsulation layer is divided into multiple sub-layers (first encapsulation layer, second encapsulation layer with spaces, third encapsulation layer), where each layer serves specific functions. The second encapsulation layer contains air-filled spaces that reduce overall permittivity while maintaining protective coverage.
Solution Approach 2:
Different regions of the encapsulation structure have different properties: the solid encapsulation layers provide protection and barrier functions, while the air-filled spaces in the second encapsulation layer provide low permittivity to reduce noise interference. This local differentiation of properties resolves the contradiction between protection and noise reduction.
2Measurement precision
If the encapsulation layer permittivity is reduced to improve sensor sensitivity, then noise interference decreases, but protection effectiveness may be compromised
Solution Approach 1:
The encapsulation is segmented into multiple layers with different dielectric properties. The air-filled spaces reduce average permittivity for improved sensor sensitivity, while the solid encapsulation layers maintain protective barriers against moisture and oxygen.
Solution Approach 2:
The encapsulation structure uses a composite of solid encapsulation materials and air (vacuum), creating a multi-phase composite structure. This composite approach allows tuning of effective permittivity while maintaining protective functions through the solid phases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively protects the light emitting elements from moisture and oxygen while reducing noise interference, thereby improving the sensitivity of the sensor layer by lowering the signal-to-noise ratio.
Implementation Method 1
reducing the permittivity and enhancing sensor layer sensitivity
Data Source
AI summary
An electronic device includes a base layer. A circuit layer is disposed on the base layer. A light emitting element layer is disposed on the circuit layer and includes a light emitting element. An encapsulation layer includes a first encapsulation layer that covers the light emitting element layer, a second encapsulation layer disposed on the first encapsulation layer and including a space, a mask pattern layer disposed on the second encapsulation layer and including an opening, and a third encapsulation layer disposed on the second encapsulation layer and covering the mask pattern layer. A sensor layer is disposed on the encapsulation layer. The opening overlaps the space in a plan view.