Thin Film Encapsulation Apparatus for Flexible Displays
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Solution Overview
Problem
Current display device manufacturing technologies face challenges in adjusting the thicknesses of organic and inorganic layers and maintaining uniform vacuum conditions during the thin film encapsulation process, which affects the quality and longevity of flexible display devices.
Innovation Solution
A method involving a thin film encapsulation manufacturing apparatus that forms a first inorganic layer on a substrate using sputtering, followed by an organic layer through organic deposition, and a second inorganic layer, with sequential cooling and alternating stacking, while maintaining consistent internal pressures and vacuum levels across multiple process chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If multiple thin films are formed during encapsulation to increase display device lifespan, then the lifetime is improved, but the manufacturing complexity and difficulty of maintaining uniform vacuum conditions increase
Solution Approach 1:
The manufacturing system is divided into multiple separate process chambers (first process chamber for first inorganic layer, second process chamber for organic layer, third process chamber for second inorganic layer), each optimized for specific deposition tasks. This segmentation allows independent control of vacuum conditions in each chamber while forming multiple encapsulation layers, resolving the contradiction between increased lifetime from multi-layer encapsulation and the complexity of maintaining uniform vacuum across the entire process.
2Manufacturing precision
If multiple process chambers are used to form different layers, then layer thickness control precision is improved, but maintaining consistent vacuum levels across chambers becomes more difficult
Solution Approach 1:
The patent implements preliminary vacuum preparation and calibration for each process chamber before actual deposition. The first, second, and third process chambers are separately evacuated and their vacuum levels are adjusted and stabilized prior to forming respective layers. This preliminary action ensures that each chamber reaches optimal vacuum conditions independently, enabling precise thickness control in each layer while maintaining reliable and consistent vacuum levels across all chambers throughout the manufacturing process.
3Manufacturing precision
If substrate cooling is performed to reduce temperature-related issues, then manufacturing quality is improved, but process time and energy consumption increase
Solution Approach 1:
A substrate cooling unit is introduced as an intermediary component between the process chambers and the substrate. This cooling unit actively removes excess heat from the substrate during the deposition process, allowing precise control of substrate temperature without requiring extended cooling periods. The cooling unit enables high-quality encapsulation formation while minimizing the time and energy required for temperature management, effectively resolving the contradiction between manufacturing quality and process time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise control over layer thickness and quality, enhancing the lifespan and performance of flexible display devices by ensuring uniform encapsulation and reducing temperature-related issues during the manufacturing process.
Implementation Method 1
forming a first inorganic layer on a first substrate, on which an emission unit is formed, by using a sputtering process
Implementation Method 2
cooling the first substrate on which the first inorganic layer is formed by absorbing radiation emitted therefrom in a non-contact manner
Implementation Method 3
forming a first organic layer on the first inorganic layer by an organic deposition process
Data Source
AI summary
A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.