Encapsulation Device Temperature Barrier Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing encapsulation methods for electronic components are inefficient due to long processing cycles and lack of control over the encapsulation process, leading to inconsistent quality and potential thermal damage, especially with the use of 'green compounds' that require higher temperatures.
Innovation Solution
The method involves creating separate temperature zones using a temperature barrier to regulate the temperature of the encapsulating material during the encapsulation process, allowing for precise control over viscosity, curing initiation, and speed, by heating or cooling the material in different stages, and using independent temperature control in various parts of the encapsulating device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single temperature zone is used for encapsulating material processing, then the structure is simple, but the temperature control precision and material behavior controllability are insufficient
Solution Approach 1:
The encapsulating device is divided into multiple temperature zones (first temperature zone in feed means, second temperature zone in mould cavity) separated by a temperature barrier. Each zone can be independently controlled to optimize material behavior at different stages: high temperature in the first zone for low viscosity and easy filling, and controlled temperature in the second zone for proper curing while preventing thermal damage to components.
Solution Approach 2:
Different regions of the encapsulating device are assigned different temperature characteristics. The feed means operates at a higher temperature to maintain material fluidity during filling, while the mould cavity is maintained at a lower temperature to control curing and protect temperature-sensitive components. This local differentiation of temperature quality enables precise control over the encapsulation process.
2Productivity
If high temperature is applied throughout the encapsulation process, then the encapsulating material cures faster, but thermal damage to electronic components increases
Solution Approach 1:
The temperature profile is segmented into two distinct zones: the feed means operates at higher temperature to accelerate material flow and initial curing, while the mould cavity is maintained at a lower temperature to protect electronic components from thermal damage. The temperature barrier physically separates these zones, allowing independent temperature optimization for each function.
Solution Approach 2:
A temperature barrier (insulating wall) is introduced as an intermediary element between the feed means and the mould cavity. This barrier prevents direct thermal transmission, allowing the feed means to operate at high temperature for fast processing while the mould cavity remains at a lower, safer temperature for component protection. The intermediary enables decoupling of the temperature requirements for different process stages.
3Speed
If the encapsulating material is heated to high temperature for fast filling, then the filling speed increases, but the viscosity control becomes difficult
Solution Approach 1:
The temperature control is segmented into two zones: the feed means is heated to high temperature to reduce material viscosity and enable fast filling, while the mould cavity is maintained at a lower temperature to control the curing process. The temperature barrier ensures that the high temperature in the feed means does not prematurely cure the material before filling is complete.
Solution Approach 2:
The first temperature zone maintains the encapsulating material in a liquid state with low viscosity throughout the filling process, ensuring continuous fluid flow into the mould cavity. The temperature barrier prevents premature curing, allowing the filling action to complete continuously before the material enters the second zone where curing is controlled.
4Manufacturing precision
If the processing cycle duration is extended for proper curing, then the curing quality improves, but the productivity decreases
Solution Approach 1:
The curing process is segmented into two stages occurring in different zones: initial curing begins in the first temperature zone during filling, and final curing completes in the second temperature zone after filling. This segmentation allows the material to start curing at optimal temperature during filling, then complete curing at controlled temperature in the mould cavity, achieving both high quality and efficient cycle time.
Solution Approach 2:
The first temperature zone performs preliminary heating and initial curing of the encapsulating material before it enters the mould cavity. This preliminary action reduces the curing time required in the second zone, thereby shortening the overall processing cycle while maintaining curing quality. The material arrives in the mould cavity already partially cured and at an optimal temperature for final curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time, enhances the controllability of the encapsulation process, minimizes the risk of damage to components, and allows for the use of temperature-sensitive materials by creating a considerable temperature gradient, enabling faster melting and curing while maintaining control over the encapsulating material's fluidity and reducing thermal stress on components.
Implementation Method 1
temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material during the processing steps A)-C) by creating different temperature zones separated from each other thermally by means of at least one temperature barrier
Implementation Method 2
A) heating encapsulating material such that it becomes liquid
Implementation Method 3
D) at least partially curing the encapsulating material in the mould cavity
Implementation Method 4
B) displacing the encapsulating material to a heated mould cavity enclosing the electronic component by exerting pressure on the liquid encapsulating material
Data Source
AI summary
The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mold cavity, C) filling the mold cavity, and D) curing the encapsulating material in the mold cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier.