Encapsulation Block Electrical Connections via Laser Metallization
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Solution Overview
Problem
Existing electronic devices with integrated circuit chips and carrier substrates face challenges in forming efficient and direct electrical connections, often relying on complex wire connections or interposed elements that can be cumbersome and prone to errors.
Innovation Solution
An overmolded encapsulation block with a plastic material containing additive particles is used, featuring a through-hole with an inner metal layer connected to the integrated circuit chip and a local front metal layer anchored to the additive particles, forming a direct electrical connection, and an annular peripheral portion with through-holes for connections to the carrier substrate, utilizing laser activation and metallization to create these metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire connections or interposed electrical connection elements are used to connect integrated circuit chips to carrier substrates, then electrical connections can be established, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges the encapsulation block with the electrical connection function by integrating conductive traces directly into the encapsulation material. The encapsulation block no longer merely protects the chip but also serves as the electrical connection medium, eliminating the need for separate wire connections or interposed elements between the chip and carrier substrate
Solution Approach 2:
The encapsulation block is given multiple functions: it provides mechanical protection for the integrated circuit chip, serves as an electrical connection medium through embedded conductive traces, and acts as a structural support element. This multi-functional design eliminates the need for separate dedicated connection components
2Reliability
If wire connections or interposed electrical connection elements are used, then electrical connections are formed, but the manufacturing process becomes more difficult and error-prone
Solution Approach 1:
The encapsulation process and electrical connection formation are merged into a single manufacturing step. The conductive traces are embedded within the encapsulation material during the molding process, eliminating subsequent steps for wire bonding or installing separate connection elements, thereby simplifying manufacturing and reducing errors
Solution Approach 2:
The conductive traces are pre-positioned and embedded within the encapsulation material before the chip is fully assembled. This preliminary formation of connection paths simplifies the subsequent assembly process and reduces the risk of misalignment or connection errors that would occur with post-assembly wire bonding
3Productivity
If traditional electrical connection methods are used, then connections are established, but the connection length increases and efficiency decreases
Solution Approach 1:
By merging the encapsulation block with the electrical connection function through embedded conductive traces, the patent creates direct and short connection paths between the chip pads and carrier substrate. This eliminates the need for long wire connections or multiple interposed elements, thereby reducing connection length and improving signal efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables straightforward, reliable, and short electrical connections between integrated circuit chips and carrier substrates, allowing for efficient assembly and reduced complexity in electronic device fabrication.
Implementation Method 1
additive particles that can be activated by laser radiation
Implementation Method 2
activating the additive particles that are located in the wall of the hole and in a local zone of the front face of the front layer running up to the hole under the effect of laser radiation
Implementation Method 3
producing, in a metal bath, a metallization phase so as to form, under the effect of the activated particles, an inner metal layer that is attached or anchored to the wall of the hole and connected to the front pad of the integrated circuit chip
Data Source
AI summary
An integrated circuit chip includes a front face having an electrical connection pad. An overmolded encapsulation block encapsulates the integrated circuit chip and includes a front layer at least partially covering a front face of the integrated circuit chip. A through-hole the encapsulation block is located above the electrical connection pad of the integrated circuit chip. A wall of the through-hole is covered with an inner metal layer that is joined to the front pad of the integrated circuit chip. A front metal layer covers a local zone of the front face of the front layer, with the front metal layer being joined to the inner metal layer to form an electrical connection. The inner metal layer and the front metal layer are attached or anchored to activated additive particles that are included in the material of the encapsulation block.