Encapsulation Cap Recesses for UV Glue Alignment
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Solution Overview
Problem
Existing electronic packages face challenges in securely fixing encapsulation caps to support plates while maintaining optical alignment and ensuring reliable adhesion of glue, especially when using light-hardening adhesives, which can be prone to misalignment and incomplete curing.
Innovation Solution
The package design incorporates local recesses on the encapsulation cap's peripheral face to expose glue beads, allowing partial hardening with UV light and subsequent complete curing in a bake oven, ensuring secure fixation and maintaining optical alignment during the process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bead of glue is deposited between the peripheral zone of the support plate and the end edge of the peripheral wall of the encapsulation cap, then reliable adhesion is achieved, but misalignment and incomplete curing occur
Solution Approach 1:
The encapsulation cap features local recesses at specific positions on its peripheral outer face, creating localized areas where the glue bead is exposed and can be precisely cured by UV light. This local modification allows selective hardening at critical positions without requiring the entire glue bead to be accessible, thereby maintaining alignment precision while ensuring reliable adhesion.
2Productivity
If UV light is used to harden the glue bead, then quick curing is achieved, but incomplete curing occurs due to lack of light access
Solution Approach 1:
The glue bead is segmented into multiple portions, with at least one portion being locally exposed through recesses in the encapsulation cap. This segmentation allows UV light to access and cure specific portions of the glue bead quickly, while the remaining portions are cured subsequently by heat in the bake oven, ensuring complete curing without compromising reliability.
Solution Approach 2:
UV light is applied to perform preliminary hardening of the glue bead at positions accessible through the local recesses, providing initial fixation and alignment stability. This preliminary action is followed by complete curing in the bake oven, ensuring full adhesion strength is achieved.
3Strength
If the encapsulation cap is securely fixed to the support plate, then stable assembly is achieved, but optical alignment is lost during fixation
Solution Approach 1:
The encapsulation cap is preliminarily fixed to the support plate using the glue bead and UV light hardening, establishing initial optical alignment. This preliminary fixation is sufficient to maintain alignment during subsequent handling and the bake oven curing process, ensuring both stable assembly and preserved optical alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a robust and precise attachment of the encapsulation cap to the support plate, ensuring reliable adhesion and maintaining optical alignment, even during collective fabrication, by utilizing local recesses for partial glue hardening and subsequent oven curing.
Implementation Method 1
Said glue can be capable of hardening under the effect of a light radiation and of heat
Implementation Method 2
said second equipment item is a bake oven
Data Source
AI summary
An integrated circuit chip is mounted to a front face of a support plate. An encapsulation cap in then mounted to the support plate. The encapsulation cap includes a front wall and a peripheral wall having an end edge at least partly facing a peripheral zone of the support plate. The support plate and the encapsulation cap delimit a chamber in which the integrated circuit chip is situated. To mount the encapsulation cap, a bead of glue is inserted between the peripheral zone and the end edge of the peripheral wall of the encapsulation cap. A peripheral outer face of the encapsulation cap includes a recess extending from the end edge which locally uncovers a part of the bead of glue. A local hardening of the glue at the recess is performed as a first attachment step. Further hardening of the remainder of the glue is then performed.