Encapsulation Cover With Embedded Metal Insert For Optical Packages
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Solution Overview
Problem
Existing electronic packages with light radiation emitters and sensors face challenges in effectively integrating optical elements and metal inserts to enhance light transmission, structural integrity, and thermal management while maintaining a compact and efficient design.
Innovation Solution
The encapsulation cover integrates a metal insert embedded within a molded cover body, where the optical elements are strategically placed to allow light transmission through the cover, and the metal insert contributes to heat dissipation and electromagnetic shielding, with a fabrication process involving a mold-based overmolding technique to create a robust and functional package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If glass optical elements are attached to shoulders using adhesive layers, then light transmission is enabled, but structural integrity and thermal management are compromised
Solution Approach 1:
The patent combines the optical element mounting function with the metal insert structure. The optical element is integrated into the metal insert through precision boreholes and shoulders, eliminating the need for separate adhesive layers while maintaining structural integrity and enabling both light transmission and thermal management simultaneously.
Solution Approach 2:
The invention uses composite construction by integrating optical elements (glass or plastic) into a metal insert structure. This composite approach allows the metal insert to provide structural strength and thermal management while the optical elements enable light transmission, resolving the contradiction between these functions.
2Adaptability or versatility
If multiple separate components are assembled, then functionality is achieved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent merges multiple functions into a single integrated metal insert component that includes precision boreholes for optical elements, mounting shoulders, and thermal management features. This integration reduces the number of separate components and assembly steps while maintaining all required functionalities.
Solution Approach 2:
The metal insert is pre-fabricated with precision boreholes and mounting features before being integrated into the encapsulation cover. This preliminary preparation of the metal insert reduces on-site assembly complexity and enables more efficient manufacturing of the complete package.
3Ease of manufacture
If optical elements are mounted with adhesive layers, then assembly is simplified, but thermal management capability is reduced
Solution Approach 1:
The invention uses a composite structure where optical elements are mounted in precision boreholes of a metal insert. The metal insert provides superior thermal management compared to adhesive layers, while the precision fitting maintains assembly simplicity. The composite design enables both thermal management and ease of manufacture.
Solution Approach 2:
The patent extracts the adhesive layer from the optical element mounting process and replaces it with a precision mechanical fit within the metal insert. This extraction eliminates the thermal insulation effect of adhesives while maintaining assembly simplicity through the pre-fabricated metal insert with integrated mounting features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables efficient light transmission, improved thermal management, and enhanced structural integrity for electronic packages, allowing for precise detection of proximity and effective light emission, while maintaining a compact form factor.
Implementation Method 1
the optical element allowing light to pass through from one face to the other of said wall
Implementation Method 2
the metal insert contributes to heat dissipation
Implementation Method 3
the metal insert contributes to electromagnetic shielding
Data Source
AI summary
An encapsulation cover for an electronic package includes a frontal wall with a through-passage extending between faces. The frontal wall includes an optical element that allows light to pass through the through-passage. A cover body and a metal insert that is embedded in the cover body, with the cover body being overmolded over the metal insert, defines at least part of the frontal wall.