Encapsulation Film Composition for Organic Electronics Moisture Barrier
Solution Overview
Problem
Organic electronic devices are vulnerable to external factors like water and oxygen, leading to adhesion reliability issues under high temperature and high humidity conditions, which compromises their moisture barrier performance and optical properties.
Innovation Solution
A composition for encapsulation film comprising a base resin with a polyisobutylene backbone and an additive having a polar functional group, ensuring compatibility and maintaining adhesion reliability and moisture barrier performance even under challenging conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an encapsulation film is applied to large-area devices, then coverage area is improved, but bubble formation increases
Solution Approach 1:
The patent modifies the chemical parameters of the adhesive material by introducing polar functional groups into the polyisobutylene backbone. This changes the surface energy and wetting properties of the adhesive, enabling it to spread uniformly across large areas and displace air effectively during lamination, thereby preventing bubble formation even on large-area devices.
2Reliability
If an additive with polar functional group is added to enhance adhesion, then adhesion reliability is improved, but optical properties may deteriorate
Solution Approach 1:
The patent applies the polar functional groups locally at the interface between the encapsulation film and the electrode/organic material, rather than throughout the entire film bulk. This localized modification enhances adhesion reliability at the critical interface while maintaining the optical transparency of the bulk encapsulation film, thus resolving the contradiction between adhesion and optical properties.
Data Source
AI summary
There are provided a composition for encapsulation film, an encapsulation film, and an electronic device having the same. The present application may provide an encapsulation film having an excellent moisture barrier property, operability, workability, and durability and a structure including an element encapsulated by the encapsulation film.