Encapsulation Film Edge Gap Control for OLED Moisture Blocking
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, face durability issues due to oxidation from external factors like moisture, and existing encapsulation methods suffer from alignment errors and contamination during the bonding process, leading to defects and reduced reliability.
Innovation Solution
An encapsulation film with a metal layer and an encapsulation layer having a pressure-sensitive adhesive and adhesive layer, where the gap between the metal layer and encapsulation layer edges is controlled between 50 μm to 500 μm, and the adhesive layer thickness is between 5 μm to 40 μm, ensuring excellent bonding and adhesion without overflow during bonding and curing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the encapsulation layer is pre-attached to the substrate in a roll-to-roll manner and then cut, then alignment errors and bonding defects are reduced, but contamination occurs due to overflow of the encapsulation layer in bonding and thermosetting processes
Solution Approach 1:
The encapsulation layer is designed with different properties in different regions: the central bonding area has sufficient adhesive thickness for reliable bonding, while the peripheral areas are trimmed to prevent overflow. This local differentiation allows the system to achieve both good bonding reliability and contamination prevention.
Solution Approach 2:
The encapsulation layer is divided into a bonding region and a peripheral region that is trimmed away. This segmentation allows the bonding process to occur in a controlled central area while eliminating the risk of peripheral material overflow causing contamination.
2Reliability
If the encapsulation layer size is made larger to ensure complete coverage, then protection against moisture and oxygen is improved, but alignment errors increase during bonding processes
Solution Approach 1:
The encapsulation layer is pre-attached to the substrate with proper alignment before the actual device assembly. This preliminary bonding action allows for correction and adjustment, ensuring that the final positioning achieves both complete coverage and high alignment accuracy.
Solution Approach 2:
The adhesive layer thickness is optimized to a specific range (5-40 μm) to balance coverage and alignment. This parameter control ensures sufficient protection against moisture and oxygen while maintaining manageable dimensions for precise alignment during bonding.
3Strength
If the adhesive layer thickness is increased to improve bonding strength, then bonding reliability is enhanced, but overflow during bonding and curing processes increases causing contamination
Solution Approach 1:
The adhesive layer thickness is optimized to a specific range (5-40 μm) that balances bonding strength and overflow prevention. This parameter control ensures sufficient adhesion while maintaining manageable dimensions during bonding and curing processes.
Solution Approach 2:
The adhesive layer is effectively segmented by trimming the peripheral encapsulation layer, concentrating the adhesive material in the central bonding area. This ensures strong bonding where needed while preventing overflow-induced contamination at the periphery.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation film effectively blocks moisture and oxygen, providing enhanced handleability, processability, and bonding reliability, reducing defects and contamination, thus improving the endurance of organic electronic devices.
Implementation Method 1
The encapsulation layer (12) may comprise a pressure-sensitive adhesive layer (121) and an adhesive layer (122)
Implementation Method 2
The encapsulation layer (12) may comprise a pressure-sensitive adhesive layer (121) and an adhesive layer (122)
Data Source
AI summary
The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.