Encapsulation Film Metal Layer Protective Resin Structure
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Solution Overview
Problem
Organic electronic devices, such as OLEDs, are sensitive to moisture and oxygen, leading to durability issues due to oxidation of organic materials and metal electrodes, requiring effective encapsulation to maintain reliability.
Innovation Solution
An encapsulation film with a protective layer having a specific glass transition temperature range and thickness, combined with a moisture-barrier metal layer, to prevent physical and chemical damage during the encapsulation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is added to prevent physical and chemical damage during encapsulation, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent implements a nested multi-layer structure where the encapsulation film contains an encapsulation layer, metal layer, and protective layer sequentially arranged. Each layer is embedded within the previous one, creating a nested configuration that provides progressive protection while maintaining a compact overall structure. This resolves the contradiction by organizing complexity in a hierarchical manner that delivers enhanced reliability without proportionally increasing device footprint.
Solution Approach 2:
The patent uses composite material construction by combining different materials with complementary properties: the encapsulation layer provides base protection, the metal layer offers moisture and oxygen barrier properties, and the protective layer adds mechanical strength and chemical resistance. This composite approach achieves superior reliability through material synergy while the functional differentiation allows each layer to be optimized independently, managing overall complexity.
2Reliability
If the protective layer thickness is increased to prevent metal layer corrosion, then reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent specifies a glass transition temperature range of 0°C or higher and 50°C to 200°C for the protective layer resin component. By controlling this critical parameter (glass transition temperature), the patent ensures the protective layer maintains appropriate mechanical properties and adhesion across different operating conditions. This parameter control approach allows for reliable corrosion protection without requiring extreme thickness precision, as the material properties compensate for minor thickness variations.
3Reliability
If encapsulation is implemented to block moisture and oxygen, then reliability is improved, but ease of manufacture decreases
Solution Approach 1:
The patent divides the encapsulation function into three distinct segments or layers: the encapsulation layer for base sealing, the metal layer for moisture and oxygen blocking, and the protective layer for mechanical and chemical protection. This segmentation allows each layer to be manufactured and optimized independently, then combined through lamination. This resolves the contradiction by breaking down the complex encapsulation requirement into manageable manufacturing steps while achieving comprehensive protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The encapsulation film effectively blocks moisture and oxygen, minimizing appearance changes and ensuring the reliability of organic electronic devices by preventing corrosion and damage during handling and operation.
Implementation Method 1
the resin component may have a glass transition temperature after curing in a range of 0° C. or higher, 50° C. to 200° C.
Implementation Method 2
provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside
Implementation Method 3
the encapsulation layer (11) may seal the entire surface of an organic electronic element
Data Source
AI summary
The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process.