Thin Film Encapsulation Layer Adhesion and Thickness Optimization
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Solution Overview
Problem
The surface of the inorganic layer in thin film encapsulation layers is uneven, leading to peeling issues between the organic and inorganic layers in conventional display panels.
Innovation Solution
A display panel structure featuring a first inorganic layer, a first organic layer made of hexamethyldisiloxane, and a second organic layer with epoxy resin or acryl, where hexamethyldisiloxane enhances adhesion and leveling, reducing thickness and preventing layer separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional thin film encapsulation layer with a single organic layer is used, then the manufacturing process is simple, but the surface unevenness of the inorganic layer causes peeling between layers
Solution Approach 1:
The encapsulation layer is divided into multiple organic layers (first organic layer and second organic layer) with different materials and functions. The first organic layer serves as a buffer layer for adhesion, while the second organic layer provides surface smoothness, thereby resolving the peeling issue without excessive complexity
Solution Approach 2:
Different organic materials are used in different layers: the first organic layer uses a material with good adhesion to the inorganic layer, while the second organic layer uses a material that provides surface smoothness. This composite structure addresses both adhesion and surface uniformity requirements
2Manufacturing precision
If the organic layer is made thicker to cover surface unevenness, then surface smoothness is improved, but the overall thickness of the display panel increases
Solution Approach 1:
The thickness compensation function is divided between two layers: the first organic layer compensates for surface unevenness through its buffer function, while the second organic layer provides the final smooth surface. This segmentation allows achieving surface smoothness without excessive total thickness
Solution Approach 2:
The patent optimizes the thickness parameters of each organic layer individually. The first organic layer has a thickness designed for adhesion and unevenness compensation, while the second organic layer has a thickness optimized for surface smoothness, achieving overall thinness while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a uniform first organic layer, reduces the thickness of the display panel, and prolongs its lifespan by improving adhesion between layers, preventing peeling and ensuring a smoother surface.
Implementation Method 1
hexamethyldisiloxane enhances adhesion and leveling, reducing thickness and preventing layer separation
Implementation Method 2
hexamethyldisiloxane enhances adhesion and leveling, reducing thickness and preventing layer separation
Data Source
AI summary
The present disclosure provides a display panel and a preparation method thereof. The display panel includes a substrate, a thin film transistor, a pixel layer, and a thin film encapsulation layer. Wherein the thin film encapsulation layer includes a first inorganic layer, a first organic layer, and a second organic layer. The preparation method of the display panel includes the following steps: a substrate provision step, a thin film transistor preparation step, a pixel layer preparation step, and a thin film encapsulating layer preparation step.