Encapsulation Layer Layout for Edge Crack-Resistant Displays
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Solution Overview
Problem
Display devices face reduced crack resistance at the edges due to the decrease in bezel size, which can lead to crack propagation from the edge of the display panel to the active area, compromising the integrity of the screen.
Innovation Solution
A display device design featuring a base substrate with varying thickness portions and inorganic laminated films, along with encapsulation layers, is implemented. The substrate includes a crack dam arrangement area with recess patterns and inorganic laminated films that inhibit crack propagation by inducing cracks to disappear or reduce along the extension direction, and the encapsulation layers are strategically positioned to prevent cracks from reaching the active area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the bezel size is minimized to achieve a larger display area, then the display area increases, but the crack resistance at the edges decreases
Solution Approach 1:
The base substrate is divided into multiple thickness portions (first thickness portions and second thickness portions) within the non-active area. This segmentation creates a stepped structure that acts as a crack barrier, preventing cracks from propagating into the active area while maintaining a minimized bezel size for maximum display area.
Solution Approach 2:
Different regions of the base substrate are given different thicknesses to serve different functions. The first thickness portions provide structural support and crack resistance, while the second thickness portions allow for a thinner overall profile. This local differentiation enables the substrate to simultaneously achieve both crack resistance and minimized bezel size.
2Strength
If the base substrate thickness is increased at the crack dam arrangement area to improve crack resistance, then the crack resistance improves, but the manufacturing complexity increases
Solution Approach 1:
The thickness parameter of the base substrate is changed in specific regions (non-active area) to create the crack dam structure. By controlling the thickness parameter differently in first and second thickness portions, the patent achieves improved crack resistance while using standard thin-film fabrication techniques to manage manufacturing complexity.
Data Source
AI summary
A display device includes: a base substrate including an active area, and a non-active area including a crack dam arrangement area; a plurality of inorganic layers on the base substrate; and an encapsulation layer on the plurality of inorganic layers, and including an encapsulation inorganic layer, and an encapsulation organic layer on the encapsulation inorganic layer. The base substrate includes first substrate portions having a first thickness at the crack dam arrangement area, and a second substrate portion between adjacent ones of the first substrate portions and connected to the first substrate portions, the second substrate portion having a second thickness smaller than the first thickness. The plurality of inorganic layers are laminated to form an inorganic laminated film at the crack dam arrangement area; and the encapsulation inorganic layer is located over the first substrate portions and the second substrate portion, and includes at least one short circuit portion.