Electronic Package Encapsulation Layout for Close-Range Signal Routing
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Solution Overview
Problem
Conventional electronic packages face challenges in achieving miniaturization and low power consumption while maintaining high electrical performance due to limited space for auxiliary functional components, leading to increased manufacturing costs and inefficient signal transmission.
Innovation Solution
An electronic package with an encapsulation layer and conductive pillars that embeds an electronic structure with conductive vias and conductors, allowing for close-range connection with other components without redesigning the package or expanding component sizes, using a manufacturing method that forms conductors, bonding, and insulating layers to create a compact and efficient structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If auxiliary functional components are directly provided on the circuit board, then the distance between components is reduced, but the volume of the end product increases and signal transmission path becomes too long
Solution Approach 1:
The auxiliary functional component is embedded within the encapsulation layer of the package structure, nesting it inside the existing package volume. This allows the component to be integrated without increasing the overall end product volume while maintaining short signal transmission distance through the encapsulation layer.
Solution Approach 2:
The auxiliary functional component is positioned in the vertical dimension (embedded in the encapsulation layer) rather than being placed on the horizontal plane of the circuit board. This dimensional change enables close-range connection without increasing the footprint area, thus maintaining compact product volume.
2Ease of operation
If auxiliary functional components are integrated to the lower side of the package substrate, then the transmission distance is shortened, but the surface area and volume of the circuit board must be reduced which limits component placement
Solution Approach 1:
The auxiliary functional component is nested within the encapsulation layer rather than being placed on the circuit board surface. This eliminates the need to reduce circuit board surface area for component placement while achieving short transmission distance through the embedded position.
3Adaptability or versatility
If multiple auxiliary functional components are integrated into the package structure, then functionality is increased, but the available space in the package structure becomes insufficient
Solution Approach 1:
The auxiliary functional component is nested within the encapsulation layer, utilizing the existing package volume efficiently. This nesting approach allows multiple components to be integrated without proportionally increasing the overall package volume, as they share the encapsulation space.
Solution Approach 2:
The encapsulation layer acts as a flexible container that can accommodate auxiliary functional components within its structure. This thin-film encapsulation approach provides space for additional functionality without significantly increasing the rigid package dimensions.
4Ease of manufacture
If conventional packaging techniques are used with separate auxiliary components, then manufacturing is simpler, but power consumption increases and electrical performance degrades
Solution Approach 1:
The auxiliary functional component is nested within the encapsulation layer, creating a compact integrated structure that reduces signal transmission distance. This embedded positioning lowers power consumption through shorter electrical paths while the encapsulation process itself remains a standard manufacturing technique.
Data Source
AI summary
An electronic package and a manufacturing method thereof, which embeds an electronic structure acting as an auxiliary functional component and a plurality of conductive pillars in an encapsulation layer, and disposes an electronic component on the encapsulation layer, so as to facilitate electrical transmission with the electronic component in a close range.