Encapsulation Structure With Partition Walls For Flexible Electronics
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Solution Overview
Problem
Flexible electronic elements made of organic materials face challenges in maintaining gas-barrier properties while preserving flexibility, as full-layer gas barrier solutions either compromise flexibility or fail when flexed.
Innovation Solution
An encapsulation structure featuring a flexible substrate with a first gas barrier layer covering electronic elements and partition walls, where the surface energy of the first partition wall is higher than the second, and a flexible structure with a Young's modulus between 0.2 GPa and 2 GPa is used, allowing for effective moisture and oxygen blocking without compromising flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an entire layered gas barrier layer is used to cover all electronic elements on the flexible substrate, then moisture and oxygen resistance is improved, but flexibility of the flexible substrate deteriorates
Solution Approach 1:
The gas barrier layer is divided into multiple discrete isolated barrier structures rather than a continuous layer. Each electronic element is covered by its own separated gas barrier structure, which prevents moisture and oxygen ingress while allowing the flexible substrate to bend without the entire layer cracking or losing flexibility.
Solution Approach 2:
The gas barrier structures are applied locally only where electronic elements are present, rather than covering the entire flexible substrate uniformly. This localized approach provides protection exactly where needed while preserving the overall flexibility of the substrate in non-device regions.
2Adaptability or versatility
If the entire layered gas barrier layer is made too thin, then flexibility is improved, but moisture and gas resistance deteriorates
Solution Approach 1:
The gas barrier function is segmented into multiple discrete structures that can be optimized independently. Each isolated barrier structure can be designed with appropriate thickness to provide sufficient protection, while the segmented nature allows the overall structure to remain flexible.
3Reliability
If the entire layered gas barrier layer is made too thick, then moisture and gas resistance is improved, but flexibility is lost and the gas barrier layer breaks when flexed
Solution Approach 1:
The gas barrier layer is segmented into multiple isolated structures rather than a continuous thick layer. This segmentation allows each individual barrier structure to be sufficiently thick for protection while preventing the entire layer from cracking or breaking during flexing operations.
Solution Approach 2:
The gas barrier structures are designed as flexible conformal coatings that can bend with the substrate. The isolated barrier structures follow the contour of the underlying electronic elements and substrate, maintaining flexibility while providing thick-enough protection where needed.
Data Source
AI summary
An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.