Electronic Device Encapsulation Patterns for Bend Separation

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Solution Overview

Problem

Organic light emitting display panels face a separation phenomenon between the light emitting element layer and the encapsulation layer due to low adhesive strength, especially when bent, leading to reliability issues.

Innovation Solution

The electronic device incorporates a base layer with specific patterns and a spacer structure, where the patterns have a reverse taper shape, a width of 3-4 micrometers, and a thickness of 1-2 micrometers, positioned between the light emitting layers to enhance adhesion and prevent separation, thereby increasing the reliability of the device.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the encapsulation layer is applied to protect the light emitting element layer, then moisture and oxygen permeation is prevented, but the encapsulation layer separates from other elements when bent due to low adhesive strength

Engineering Contradiction:
Improveprotection against moisture and oxygenVSAvoidadhesive strength of encapsulation layer
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The encapsulation layer is divided into multiple segments (first encapsulation layer and second encapsulation layer) that are disposed at different positions. The first encapsulation layer is disposed on the light emitting element layer while the second encapsulation layer is disposed on the electrode, creating segmented protection zones that reduce stress concentration and prevent delamination during bending.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different regions of the display device are provided with different encapsulation structures tailored to their specific needs. The light emitting element layer area receives the first encapsulation layer while the electrode area receives the second encapsulation layer, optimizing both adhesion and protection locally rather than applying a uniform encapsulation structure throughout.

Inventive Principle:
Principle #3Local quality

2Adaptability or versatility

If the encapsulation layer is made thinner to maintain flexibility, then bending is easier, but adhesive strength decreases and separation occurs

Engineering Contradiction:
Improveflexibility for bendingVSAvoidadhesive strength
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The encapsulation function is segmented across multiple layers positioned at different locations. This segmentation allows each layer to be optimized for its specific function - providing both flexibility and adhesion without requiring a single thick encapsulation layer that would compromise bending capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The display device employs a composite encapsulation structure combining organic encapsulation layers and inorganic encapsulation layers. This composite approach leverages the flexibility of organic materials and the barrier properties of inorganic materials, achieving both bendability and adhesive strength through material composition rather than single-layer thickness.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20230189574A1Electronic device
Publication Date: 2023.06.15 SAMSUNG DISPLAY CO LTD
  • US20230189574A1 patent drawing
  • US20230189574A1 patent drawing
  • US20230189574A1 patent drawing

AI summary

An electronic device includes a base layer, a plurality of first electrodes on the base layer, a pixel definition layer on the first electrodes and including a plurality of openings that expose a portion of the first electrodes,, a plurality of light emitting layers on the first electrodes, a plurality of patterns on the pixel definition layer, a second electrode on the light emitting layers, and an encapsulation layer on the patterns and the second electrode. The patterns are disposed between the light emitting layers when viewed in a plane, and each of the patterns has a width from about 3 micrometers to about 4 micrometers.