Encapsulation Recess Structure for Reliable Electronic Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing structural designs and manufacturing processes for electronic devices struggle to meet the increasing demands for reliability and quality as they become lighter, thinner, and smaller, particularly in ensuring effective encapsulation and electrical connections between electronic elements and substrates.
Innovation Solution
The encapsulating layer is designed with a recess to increase the contact area with the underfill, enhancing the reliability and quality of the electronic device by improving the adhesion and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the electronic device is made lighter, thinner, and smaller, then the portability and integration are improved, but the reliability and quality of electrical connections deteriorate
Solution Approach 1:
The patent introduces a recess structure in the encapsulating layer, transforming a two-dimensional flat surface into a three-dimensional feature. This recess increases the contact area between the underfill and the encapsulating layer, providing enhanced adhesion and electrical connection reliability without increasing the overall device footprint, thus resolving the contradiction between miniaturization and connection reliability.
2Reliability
If the contact area between underfill and encapsulating layer is increased, then the adhesion and electrical connections are improved, but the device size increases
Solution Approach 1:
The recess structure utilizes the vertical dimension (depth) to increase the effective contact area between the underfill and encapsulating layer. By creating a downward protrusion or cavity in the encapsulating layer, the patent achieves greater adhesion area without expanding the horizontal footprint of the device, thus resolving the contradiction between adhesion quality and device area.
Solution Approach 2:
The recess structure essentially nests additional contact area within the existing device footprint. The underfill material fills the recess cavity, creating a nested configuration where the increased adhesion interface is contained within the original device boundaries, allowing improved reliability without increasing overall device size.
Data Source
AI summary
The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes at least one first electronic unit, a molding layer surrounding the at least one first electronic unit, a circuit structure electrically connected to the at least one first electronic unit, a conductive layer in which the circuit structure and the conductive layer are corresponded to the opposite sides of the molding layer, and a connection element disposed between the circuit structure and the conductive layer. The molding layer surrounds the connection element and includes a recess.