Encapsulation Resin Composition for Large-Substrate Warpage Suppression
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Solution Overview
Problem
Large-area substrates experience significant warpage when encapsulated with thermosetting resins due to differences in thermal expansion coefficients, which complicates subsequent processing steps.
Innovation Solution
A resin composition combining epoxy resin, a polyalkylene glycol chain compound, and an inorganic filler, particularly spherical silica, is used to suppress warpage in substrates with areas of 7000 mm2 or more, optimizing the composition's content and molecular weight to enhance thermal stability and fluidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large-area substrate is encapsulated with a thermosetting resin, then the substrate is protected from heat, light, moisture, dust, and physical impact, but large warpage occurs due to difference in thermal expansion coefficient between the substrate and resin
Solution Approach 1:
The patent modifies the chemical composition parameters of the encapsulation resin by incorporating specific polyalkylene glycol chain compounds (B-1 and B-2) with defined molecular weights and structures. This changes the thermal expansion characteristics of the cured resin to better match the substrate, thereby reducing warpage while maintaining protective functions
Solution Approach 2:
The patent creates a composite resin system combining epoxy resin (A) with polyalkylene glycol chain compounds (B-1 and B-2) and inorganic fillers (C). This composite formulation achieves balanced thermal expansion properties that reduce warpage while providing comprehensive protection against environmental factors
2Reliability
If the warpage is large, then the substrate is protected, but problems arise in the subsequent polishing process and singulation process
Solution Approach 1:
By adjusting the resin composition parameters to include specific polyalkylene glycol chain compounds, the patent reduces warpage to levels that enable precise polishing and singulation operations, thereby improving manufacturing precision while preserving substrate protection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively reduces warpage in large-area substrates during encapsulation, improving heat resistance and molding fluidity while maintaining low warpage, suitable for encapsulating electronic members with areas up to 30000 mm2 or more.
Implementation Method 1
large warpage occurs due to a difference in the thermal expansion coefficient between the substrate and the thermosetting resin
Data Source
AI summary
An object of the present invention is to provide a resin composition for encapsulation capable of suppressing warpage even when a large-area substrate is encapsulated.In order to solve the above problems, a resin composition for encapsulating an electronic member containing an epoxy resin (A), a compound having a polyalkylene glycol chain (B), and an inorganic filler (C) is provided.Thus, even when a large-area substrate is encapsulated, an effect of suppressing the warpage can be obtained.