Encapsulation Substrate Coating for Frit Bond Strength
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing bond strength between an encapsulation substrate and a frit in organic light emitting display devices is limited, leading to vulnerability to external impacts and moisture penetration, which reduces the durability of the organic light emitting element.
Innovation Solution
A glass stack is formed with a self-aligned lower and upper coating layer on the encapsulation substrate, containing compounds with an intramolecular (OCH2CH2)n-OH structure, which enhances the physical/chemical bond between the encapsulation substrate and the glass frit, improving the bond strength and durability of the display device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a frit material is used to bond the encapsulation substrate and light emitting substrate, then the device can be manufactured with standard bonding processes, but the bond strength is limited and the bonding surface is vulnerable to damage from external impacts
Solution Approach 1:
A self-aligned coating layer containing compounds with intramolecular (OCH2CH2)n-OH structure is introduced as an intermediary between the encapsulation substrate and the frit material. This coating layer enhances the physical/chemical bond between the encapsulation substrate and glass frit, significantly improving bond strength while maintaining ease of manufacture through standard bonding processes.
2Ease of manufacture
If the bond strength between encapsulation substrate and frit is insufficient, then manufacturing can be simplified, but moisture and air can penetrate through the bonding surface, reducing durability
Solution Approach 1:
The self-aligned coating layer acts as an intermediary that creates a stronger physical/chemical bond between the encapsulation substrate and frit material. This enhanced bonding prevents moisture and air penetration through the bonding surface, thereby improving the durability and reliability of the organic light emitting element while maintaining a relatively simple bonding structure.
3Strength
If a stronger bonding method is used to improve bond strength, then durability is improved, but the device complexity increases
Solution Approach 1:
The coating layer is formed through self-alignment, where the compound with intramolecular (OCH2CH2)n-OH structure automatically orients itself to enhance the physical/chemical bond between the encapsulation substrate and frit material. This self-service mechanism improves bond strength without requiring complex bonding structures or additional alignment processes, thereby maintaining device simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved bond strength between the encapsulation substrate and the frit significantly enhances the mechanical strength and durability of the display device, preventing moisture and air penetration and maintaining the integrity of the organic light emitting element.
Implementation Method 1
containing compounds with an intramolecular (OCH2CH2)n-OH structure, which enhances the physical/chemical bond between the encapsulation substrate and the glass frit
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Provided are a display device, a method of manufacturing the same, and a glass stack. The display device includes a light emitting substrate (100) which comprises a base (110) and a light emitting element (150) disposed on the base; an encapsulation substrate (200) which is disposed on the light emitting substrate; a frit (310) which surrounds the light emitting element and is disposed between the light emitting substrate and the encapsulation substrate; and a first coating layer (411) which is disposed between the encapsulation substrate and the frit, and comprises a compound having an intramolecular *-(OCH2CH2)-OH structure, and at least partially contacting the frit.