Encapsulation Substrate Melting and Fusing Patterns for Display Panel Bonding
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Solution Overview
Problem
Existing display devices face challenges in enhancing the bonding force between the display panel and the encapsulation substrate, particularly in preventing damage to metal line layers during the fusing process, which affects the durability and reliability of the device.
Innovation Solution
Incorporating melting patterns with a different refractive index in the encapsulation substrate to prevent pulsed laser irradiation on metal line layers, and forming fusing patterns that do not overlap with the metal line layers, ensuring strong bonding between the display panel and the encapsulation substrate without damaging the metal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If fusing patterns are formed by pulsed laser irradiation to enhance bonding force between display panel and encapsulation substrate, then bonding strength is improved, but metal line layers may be damaged by laser irradiation
Solution Approach 1:
The encapsulation substrate is divided into two functional regions: melting patterns (first region) that block laser irradiation from reaching metal lines, and fusing patterns (second region) that provide bonding strength. This segmentation allows simultaneous achievement of laser protection and strong adhesion.
Solution Approach 2:
Different regions of the encapsulation substrate are given different properties: the first region contains melting patterns with laser-blocking characteristics to protect metal lines, while the second region contains fusing patterns with high bonding characteristics to provide adhesion. This local differentiation resolves the contradiction between protection and bonding.
2Reliability
If melting patterns are added to block laser irradiation from metal line layers, then metal line protection is improved, but device structure becomes more complex
Solution Approach 1:
The protective melting patterns and bonding fusing patterns are merged into a single encapsulation substrate as integrated functional regions. This combining approach provides both laser protection and bonding functionality without requiring separate components, thus limiting the increase in device complexity.
3Strength
If fusing patterns are formed to enhance adhesion between sealing member and substrates, then bonding strength is improved, but durability against external impact may be compromised due to potential metal line damage
Solution Approach 1:
The encapsulation substrate is segmented into protective melting patterns and bonding fusing patterns, ensuring that metal lines are shielded from laser damage while maintaining strong adhesion. This segmentation preserves both bonding strength and impact durability by preventing metal line degradation.
Solution Approach 2:
The encapsulation substrate exhibits local quality differentiation where the first region provides laser protection to maintain metal line integrity for impact resistance, while the second region provides strong bonding. This local property assignment simultaneously achieves adhesion enhancement and durability preservation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding force and durability of the display device by preventing damage to metal line layers during the fusing process, thereby improving the device's resistance to external impacts and maintaining electrical integrity.
Implementation Method 1
The melting patterns may have a refractive index different from that of the nearby region, and can prevent the pulsed laser irradiated during a process of forming the fusing period of times from being irradiated onto the metal line layer
Implementation Method 2
fusing patterns formed as materials of the sealing member, the encapsulation substrate and the display panel are fused and attached at the boundary between the sealing member and the encapsulation substrate and the boundary between the sealing member and the display panel
Data Source
AI summary
A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.