Thin-Film Encapsulation Thickness Feedback Between Deposition Chambers
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Solution Overview
Problem
Existing methods for manufacturing display panels face challenges in accurately measuring the thickness of the inorganic layers in thin film encapsulation layers during the manufacturing process, which affects the protection of light-emitting elements from foreign substances.
Innovation Solution
An apparatus and method that includes a layer thickness measuring device integrated between process chambers to measure the thickness of the first inorganic layer immediately after deposition, allowing for real-time adjustment of the deposition amount to achieve the target thickness, followed by the deposition of organic and second inorganic layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If thickness measurement is performed after complete encapsulation layer formation, then all layers are protected, but measurement timing is delayed and cannot control subsequent deposition
Solution Approach 1:
The patent applies preliminary action by measuring the thickness of the first inorganic layer immediately after its deposition, before forming the organic layer and second inorganic layer. This early measurement enables real-time feedback control of deposition parameters for subsequent layers, ensuring target thickness is achieved without waiting for complete encapsulation formation.
Solution Approach 2:
The patent implements feedback control by using the thickness measurement result of the first inorganic layer to adjust deposition parameters for the second inorganic layer. The measurement system provides real-time data that feeds back to the deposition process control, enabling dynamic optimization of deposition amount and conditions to achieve precise thickness control.
2Manufacturing precision
If real-time thickness measurement is implemented, then deposition amount can be precisely controlled, but additional equipment and process steps are required
Solution Approach 1:
The patent uses an intermediary measurement system positioned between the deposition chamber and the next process stage. This intermediary device measures the thickness of the first inorganic layer without disrupting the deposition process, providing critical data that mediates the control of subsequent deposition parameters for the second inorganic layer.
Solution Approach 2:
The patent replaces complex mechanical measurement and adjustment systems with optical or non-contact measurement technology. The thickness measurement is performed using light interaction with the deposited layer, eliminating the need for physical contact or complex mechanical gauges, thereby reducing overall system complexity while maintaining high precision.
3Productivity
If thickness measurement is performed early in the process, then subsequent deposition can be optimized, but the measured layer is not yet fully encapsulated
Solution Approach 1:
The patent performs preliminary measurement of the first inorganic layer thickness before complete encapsulation is formed. This preliminary action enables optimization of subsequent deposition processes while the layer is still accessible for measurement, improving overall manufacturing efficiency without compromising final product reliability since the measurement occurs under controlled conditions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures precise control of the thin film encapsulation layer thickness, enhancing the protection of light-emitting elements and improving the manufacturing efficiency by reducing the need for post-process thickness adjustments.
Implementation Method 1
An ellipsometer may be used as the layer thickness measuring device. The ellipsometer may measure optical characteristics such as a thickness and refractive index of a thin film by utilizing polarization properties of light.
Data Source
Figure 1
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Figure 4A~4C
AI summary
An apparatus for manufacturing a panel includes a first process chamber in which a first inorganic layer is deposited on a substrate to cover a display element layer disposed on the substrate, a second process chamber which receives the substrate, on which the first inorganic layer is deposited, so that an organic layer is printed on the first inorganic layer, a third process chamber which receives the substrate, on which the organic layer is printed, so that a second inorganic layer is deposited on the organic layer, and a layer thickness measuring device disposed between the first process chamber and the second process chamber to measure a thickness of the first inorganic layer when the substrate is transferred from the first process chamber to the second process chamber.