Encapsulation Deposition Time Compensation for Thickness Control
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Solution Overview
Problem
Existing deposition processes in display device manufacturing suffer from deviations in encapsulation layer thickness, leading to issues like view angle color shift and scattering of grease, which affect the reliability and yield of the display devices.
Innovation Solution
A deposition quality control method and system that calculates compensation times based on measured thicknesses of previous layers, using equations to adjust deposition times for subsequent layers, ensuring accurate thickness control and minimizing deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a fixed deposition time is used for all substrates, then the manufacturing process is simple and fast, but the encapsulation layer thickness deviates from the target value
Solution Approach 1:
The patent implements a feedback mechanism where the actual deposition thickness of the previous encapsulation layer is measured and used to calculate a compensation time for the next deposition process. This closed-loop control ensures that thickness deviations are corrected in real-time, improving manufacturing precision without requiring complex manual adjustments.
Solution Approach 2:
The patent dynamically adjusts the deposition time parameter based on measured thickness deviations. By calculating a compensation time (X) and adding it to the original deposition time (t1) to get a new deposition time (t2), the system adapts the process parameter to maintain target thickness accuracy while keeping the overall process automated.
2Manufacturing precision
If deposition time is extended to compensate for thickness deviations, then thickness accuracy improves, but production efficiency decreases
Solution Approach 1:
The patent applies partial compensation by calculating a compensation time (X) that is added to the original deposition time only when necessary. The compensation is based on actual measured deviations and uses a weighted average calculation, applying correction only to the extent needed to achieve target thickness, rather than uniformly extending all deposition times.
Solution Approach 2:
The system dynamically adjusts deposition time parameters based on real-time thickness measurements. By calculating compensation time (X) and applying it selectively to subsequent deposition processes, the system optimizes the balance between achieving required precision and maintaining production efficiency, avoiding unnecessary time extensions.
3Reliability
If multiple encapsulation layers are formed with different materials, then the protective function is improved, but the view angle color shift increases
Solution Approach 1:
The patent controls the deposition parameters (time, temperature, pressure) of each encapsulation layer to optimize both protective function and optical properties. By precisely controlling the deposition process parameters and using material composition data, the system achieves the desired balance between protection and minimizing view angle color shift.
Solution Approach 2:
The patent employs multiple encapsulation layers with different inorganic materials (e.g., silicon oxide, silicon nitride) that have different barrier properties and optical characteristics. This composite structure provides enhanced protective function while the specific material selection and thickness control minimize view angle color shift effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes deviations among mother substrates, improves view angle color shift properties, and prevents scattering, thereby enhancing the reliability and yield of display devices by accurately controlling encapsulation layer thickness.
Implementation Method 1
a deposition chamber, which forms a first encapsulation layer on the substrate during a deposition time
Implementation Method 2
a thickness gauge which measures a deposition thickness of the first encapsulation layer positioned in the logistics chamber
Data Source
AI summary
A deposition quality control method includes: inputting information on a first deposition time, forming a (N−2)th encapsulation on a (N−2)th substrate and a (N−1)th encapsulation on a (N−1)th substrate during the first deposition time, measuring a deposition thickness each of a (N−2)th encapsulation layer and a (N−1)th encapsulation layer, calculating a compensation time which satisfies Equations 1 and 2 below, calculating a second deposition time by adding the compensation time to the first deposition time, and forming a (N)th encapsulation layer on a (N)th substrate during the second deposition time,Y=AX+B,<Equation 1>where in Equation 1, Y denotes a deposition thickness of the (N)th encapsulation layer, A denotes deposition rate, and X denotes the compensation time,B=α*D2+(1-α)*D1,<Equation 2>where in Equation 2, D2 denotes the thickness of the (N−1)th encapsulation layer, D1 denotes the thickness of the (N−2)th encapsulation layer, and α denotes a weighted value.