Encased Test Pads for Non-Destructive IC Diagnostics
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Solution Overview
Problem
Conventional electrical devices with contacts on the bottom surface are difficult to test without damaging the device or other components on the circuit board, as removing them requires reflow processes that can damage the device and corrupt data.
Innovation Solution
Incorporating test pads within the packaging material of electrical devices, accessible from the top side, allowing for diagnostic testing without the need for destructive reflow processes, using an etching process or alignment guide to expose these pads for external access.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrical device is removed from the circuit board for testing, then the device can be tested, but the device or other components may be damaged
Solution Approach 1:
The electrical device is segmented into functional components: the integrated circuit die, the packaging material, and the test pads. The test pads are specifically positioned and structured to allow independent access for testing without requiring removal of the entire device from the circuit board, thus enabling testing while maintaining device integrity.
Solution Approach 2:
Test pads are introduced as intermediary elements that facilitate the testing process. These pads provide a controlled interface between the testing equipment and the integrated circuit die, allowing electrical connections to be made without physically removing or damaging the device or other components on the circuit board.
2Ease of operation
If the device is tested while integrated on the circuit board, then device integrity is maintained, but testing cannot be performed on bottom surface contacts
Solution Approach 1:
The test pads are positioned on the top surface of the packaging material, which is opposite to the bottom surface where the electrical contacts are located. This dimensional arrangement allows testing to be performed from the top side while the device remains integrated on the circuit board, eliminating the need to access bottom surface contacts and reducing package structure complexity.
3Ease of operation
If reflow process is used to remove the device for testing, then the device can be accessed, but the device and data are damaged
Solution Approach 1:
Test pads are pre-positioned on the top surface of the packaging material during the manufacturing process. This preliminary arrangement of test access points eliminates the need for subsequent reflow processes to access the integrated circuit die, allowing testing to be performed non-destructively and preserving data integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables non-destructive testing of electrical devices integrated on a circuit board, protecting the device and other components, and improving diagnostic accuracy without damaging the circuit board or data integrity.
Implementation Method 1
using an etching process or alignment guide to expose these pads for external access
Data Source
AI summary
A substrate is orientated parallel to a plane and includes pads that are located at a bottom surface of the substrate and external to the electrical device. A first integrated circuit die is orientated parallel to the plane and disposed above the substrate in a vertical direction. The first integrated circuit die is electrically coupled to at least some of the pads of the substrate. A packaging material is disposed above the first integrated circuit die around at least a top surface and side surfaces of the first integrated circuit die. Test pads are orientated parallel to the plane and disposed above the first integrated circuit die in the vertical direction. The test pads are electrically coupled to the first integrated circuit die and encased within the packaging material.