Enclosed Electronic Module Heat Dissipation via Thermal Conductive Devices
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Solution Overview
Problem
Enclosed electronic modules, such as optical transceivers, face challenges in heat dissipation due to increased heat generation from active components, leading to potential overheating as transmission speeds and interconnection densities rise.
Innovation Solution
An integrated heat dissipation system is implemented, featuring a top housing with openings, a heat sink mounted on the outer surface, and thermal conductive devices connecting the heat sink to active components on a printed circuit board, with thermal interface materials and solder pads to enhance heat transfer and prevent thermal interaction between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the density of interconnection system and transmission speed are increased, then productivity and performance are improved, but heat generation increases leading to overheating
Solution Approach 1:
The patent extracts the heat dissipation function from the enclosed housing by introducing thermal conductive devices that extend through openings in the housing to connect active components directly to external heat sinks. This separates the heat generation zone (inside the enclosed housing) from the heat dissipation zone (external heat sinks), allowing high-density interconnection systems to operate without overheating.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (through the housing walls) to three-dimensional heat dissipation by extending thermal conductive devices through the housing openings. This creates a vertical thermal pathway that adds a new dimension for heat transfer, enabling more efficient heat removal from high-density active components.
2Device complexity
If active components are mounted on PCB inside enclosed housing, then device integration is achieved, but heat dissipation becomes difficult
Solution Approach 1:
The patent implements a nested structure where thermal conductive devices are embedded within the enclosed housing, extending from the internal active components through the housing walls to external heat sinks. This nested arrangement maintains the integrated PCB mounting while incorporating the heat dissipation pathway within the existing device structure.
Solution Approach 2:
The patent introduces thermal conductive devices as intermediary elements between the active components on the PCB and the external heat sinks. These intermediaries facilitate heat transfer from the integrated components through the housing boundary, resolving the conflict between integration and heat dissipation.
3Adaptability or versatility
If multiple active components are mounted on PCB, then functionality is enhanced, but thermal interaction between components increases
Solution Approach 1:
The patent segments the heat dissipation system by providing individual thermal conductive devices for each active component, with separate pathways extending through different openings in the housing to distinct external heat sinks. This segmentation prevents thermal interaction between components while maintaining enhanced functionality through multiple active components on the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively establishes a thermal dissipation path from active components to the heat sink, facilitating efficient heat removal and preventing overheating, thereby ensuring reliable operation and extended lifespan of the electronic module.
Implementation Method 1
at least one thermal conductive device thermally connected between the heat sink and the active component, one portion of the at least one thermal conductive device being disposed in the opening of the top housing; thereby forming a thermal dissipation path extending from the active component, along the at least one thermal conductive device, through the opening of the top housing and to the heat sink
Implementation Method 2
a heat sink mounted on an outer surface of the top housing over the opening thereof
Data Source
AI summary
The present disclosure relates to an enclosed electronic module with single/multiple active components and an integrated heat dissipation system, including a top housing formed with one or more openings, a heat sink mounted on an outer surface of the top housing over the opening(s) thereof, a bottom housing coupled with the top housing, one or more active components mounted on a PCB between the top and bottom housings, and at least one thermal block or vapor chamber thermally connected between the heat sink and the active component(s), thereby forming one or more thermal dissipation paths extending from the active component(s), through the at least one thermal block or vapor chamber, and to the heat sink.