Enclosure for an electronic device
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Solution Overview
Problem
Current enclosure designs for electronic devices fail to effectively manage thermal stress and mechanical robustness, especially in harsh environments, leading to reduced reliability and increased risk of failure due to inadequate cooling systems.
Innovation Solution
An immersion-based thermal transfer system using a dielectric fluid infused porous medium within an enclosure, which provides both thermal transport and mechanical load dampening without the need for a pump, featuring a cooling device, thermal insulation, and electrical conductors for connectivity, ensuring efficient heat transfer and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling with fans is used, then cooling capability is improved, but mechanical robustness deteriorates due to inability to dampen sudden deceleration loads
Solution Approach 1:
The patent merges the cooling function and mechanical protection function into a single integrated system. The enclosure housing contains both the air cooling components (fans, heat sinks) and the shock-dampening components (viscoelastic material, gel) working together, allowing simultaneous thermal management and mechanical robustness without requiring separate systems
Solution Approach 2:
The patent uses composite material structures, specifically the viscoelastic material and gel substances, that combine the properties of solid and liquid phases. These materials provide both structural support for mechanical protection and fluid-like characteristics for shock absorption, enabling the enclosure to withstand sudden deceleration while maintaining cooling functionality
2Temperature
If pump systems are used for liquid cooling, then thermal transport efficiency is improved, but device complexity increases due to additional components
Solution Approach 1:
The cooling system is designed to be self-regulating without requiring external pump control. The phase change materials and thermosyphon structures automatically activate when temperature thresholds are reached, using the heat itself to drive the cooling cycle through evaporation and condensation processes, eliminating the need for powered pump systems
Solution Approach 2:
The patent replaces the mechanical pump system with passive thermal management mechanisms. Instead of using mechanical force to circulate coolant, the system relies on natural convection, phase change, and capillary action to achieve thermal transport, thereby eliminating moving parts and reducing device complexity
3Temperature
If traditional cooling systems are used, then thermal management is provided, but reliability decreases due to inadequate protection against thermal stress
Solution Approach 1:
The enclosure incorporates thermal management components and shock-dampening materials during the design and assembly phase, before thermal stress or mechanical shock occurs. The viscoelastic material and gel are pre-positioned to cushion against sudden deceleration, and the cooling system is pre-configured to manage thermal stress before it causes damage to electronic components
Solution Approach 2:
The patent utilizes materials and mechanisms that change their physical parameters in response to thermal conditions. The phase change materials alter their state (solid-liquid-gas) at specific temperature thresholds, and the viscoelastic material changes its damping characteristics with temperature, allowing the system to adaptively respond to thermal stress and improve reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains electronic devices within acceptable temperature ranges, enhances mechanical robustness, and prevents fluid leakage, thereby improving reliability and durability in harsh environments.
Implementation Method 1
a dielectric fluid inside the enclosure... for immersion cooling of an electronic device using a dielectric infused porous medium for both thermal transport
Implementation Method 2
a porous medium inside the enclosure, said porous medium at least partially immersed in said dielectric fluid... without the need for a pump to exchange the dielectric fluid in the enclosure
Implementation Method 3
a cooling device having a first surface contacting an interior surface of the enclosure and a second surface contacting the dielectric fluid, the porous medium, or both the dielectric fluid and the porous medium
Implementation Method 4
for both thermal transport and mechanical load dampening
Data Source
AI summary
A thermal transfer system includes an enclosure, optional thermal insulation inside the enclosure, a dielectric fluid inside the enclosure, and a porous medium inside the enclosure. The porous medium can be at least partially immersed in the dielectric fluid. A cooling device can have a first surface contacting an interior surface of the enclosure and a second surface contacting the dielectric fluid, the porous medium, or both. The porous medium can include a cutout or cavity configured to support an electrical or electronic device immersed in the dielectric fluid. A port can be in a wall of the enclosure and a set of electrical conductors can run through the port and the electrical or electronic device immersed in the dielectric fluid.