Enclosure with Integrated Conducting Plate for Liquid Cooling
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Solution Overview
Problem
Existing liquid cooling systems for high-density electronic racks face challenges in maintaining a proper thermal environment due to fluid connections and hoses that are prone to leaks, potentially damaging the electronics.
Innovation Solution
A contained electronics package design with an integrated conducting surface and a detachable cooling device that segregates the cooling system from the electronics, using a mounting mechanism with a pressure layer to ensure thermal contact and prevent fluid leaks, allowing for efficient liquid cooling while protecting the electronics from potential leaks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid cooling systems use fluid connections and hoses to distribute cooling liquid, then cooling capacity is improved, but reliability deteriorates due to leaks
Solution Approach 1:
The patent extracts the fluid connections and hoses from the vicinity of the electronics by implementing a separate cooling plate with integrated cooling channels. The cooling plate is positioned adjacent to the electronic component but separated by a non-conductive barrier, allowing the cooling system to operate independently without fluid lines running through or near the electronics, thus eliminating leak risks while maintaining cooling effectiveness
Solution Approach 2:
The patent introduces a non-conductive barrier as an intermediary element between the cooling plate and the electronic component. This barrier serves as a mediator that allows thermal energy to be transferred from the cooling plate to the electronics while preventing direct contact between the cooling fluid and the electronics, thereby eliminating the harmful effect of potential fluid leaks
2Productivity
If cooling devices are placed close to electronics for efficient cooling, then cooling efficiency is improved, but risk of fluid leaks to electronics increases
Solution Approach 1:
The patent segments the cooling system into distinct functional zones: the cooling plate with cooling channels, the non-conductive barrier layer, and the electronic component area. This segmentation allows the cooling function to be concentrated in the cooling plate while the barrier creates a protective boundary, enabling efficient cooling without direct exposure of electronics to potential fluid leaks
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides high reliability liquid cooling by segregating electronics from fluid leaks, ensuring proper thermal management, and simplifying manufacturing and assembly, while accommodating various device form factors and server configurations.
Implementation Method 1
One of the panels of the enclosure may include an integrated conducting plate through which heat may be extracted from the electronic device
Implementation Method 2
Liquid cooling systems may be used to cool high-density racks due to the increased cooling capacity of liquid cooling
Data Source
AI summary
In one embodiment, an electronic device cooling package includes an enclosure to house an electronics package, the enclosure including at least one panel with an integrated conducting plate exposed to both an inner surface of the at least one panel and an outer surface of the at least one panel. The electronic device cooling package further includes a mounting mechanism attached to the enclosure to detachably couple a cooling device to the outer surface of the at least one panel of the enclosure. Different electronics packaged within the cooling package includes different co-design of the cooling package and cooling devices.