Enclosure Metal Interior Layer for Shatter Resistance
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Solution Overview
Problem
Electronic device enclosures made with frangible materials can fragment or shatter upon impact, compromising the device's operation and exposing internal components to unintended environments, as existing technologies lack effective structural support and protection mechanisms.
Innovation Solution
A metal layer is deposited onto the interior surfaces of electronic device enclosures using a combination of electroless plating and electroplating techniques, bonding the frame component and outer cover, providing structural support, anti-splinter protection, and enabling features like circuit paths, heat management, and wireless power transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If frangible materials (glass/acrylic) are used for enclosure pieces, then aesthetic appearance and optical properties are improved, but structural strength and resistance to fragmentation are worsened
Solution Approach 1:
The patent applies composite materials by combining frangible enclosure pieces (glass or acrylic) with a metal layer deposited on the interior surface. This composite structure allows the enclosure to maintain the aesthetic and optical properties of glass/acrylic while the metal layer provides structural strength and prevents fragmentation. The metal layer acts as a reinforcing substrate that the frangible material is bonded to, creating a hybrid structure that exhibits properties of both materials.
Solution Approach 2:
The metal layer is applied selectively to specific regions of the enclosure interior surface, particularly at corners and edges where stress concentration occurs during impact. This localized reinforcement provides structural support where most needed while maintaining the optical clarity of the frangible material in visible areas. The primer layer and metal deposition are concentrated at critical structural zones rather than uniformly across the entire surface.
2Strength
If metal layer is deposited on interior surfaces, then structural integrity and anti-splinter protection are improved, but manufacturing complexity and process difficulty are worsened
Solution Approach 1:
The manufacturing process applies preliminary action by first depositing a primer layer on the interior surface of the frangible enclosure piece before bonding the metal layer. This primer layer preparation step ensures proper adhesion and surface conditioning in advance, creating a stable foundation for the subsequent metal deposition. The primer application, activation, and metal layer formation are performed in a predetermined sequence during manufacturing, ensuring consistent bonding quality before the enclosure is assembled and shipped.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The metal layer enhances the structural integrity and operational reliability of the enclosure by preventing fragmentation, providing a strong mechanical bond, and enabling additional functional features such as heat dissipation and wireless charging.
Implementation Method 1
A metal layer can be formed onto interior surfaces of the frame component and outer cover by a combination of electroless plating and electroplating techniques
Implementation Method 2
an electroplating process can be used to form an electroplated metal layer that overlaps the interface between the frame component and the outer cover
Implementation Method 3
The primer layers can be activated with a metal such as palladium, and can be electrolessly plated to form an electroless metal layer
Data Source
AI summary
An enclosure is formed by coupling an outer cover to a back enclosure piece. The enclosure defines an interior volume for receiving components of an electronic device. The back enclosure piece is formed from a metal frame component and a non-metal outer cover. A metal layer overlaps the metal frame component and the outer cover within the interior volume. The metal layer has a thickness that provides support and shatter resistance to the non-metal outer cover. The metal layer can form an inductor of a wireless power transfer circuit.