Enclosure Shelf Alignment for Wafer Carrier and Kit Ring Placement
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Solution Overview
Problem
In semiconductor processing and wafer handling systems, misalignment and improper placement of process kit rings and carriers by robotic arms lead to errors, damage, and inefficient processing due to the inability of existing systems to securely align and retain content in specific orientations within enclosure systems.
Innovation Solution
The introduction of shelves with alignment features and retaining devices within the enclosure system that align and secure carriers and process kit rings, preventing misalignment and ensuring correct orientation during transportation and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If robotic arms transport carriers and process kit rings without alignment features, then the system has simpler structure and easier operation, but misalignment and improper placement occur leading to errors and damage
Solution Approach 1:
The shelves are equipped with alignment features that automatically align carriers and process kit rings when placed on the shelves. The robotic arm simply needs to place the items on the shelves, and the alignment features (such as tapered surfaces, grooves, or positioning pins) automatically guide the items into the correct orientation and position, eliminating the need for the robotic arm to achieve precise alignment through complex control algorithms
Solution Approach 2:
The shelves act as an intermediary component between the robotic arm and the processing chambers. Instead of requiring the robotic arm to directly and precisely place items into chambers, the shelves serve as a buffer with built-in alignment features that automatically correct placement errors, decoupling the simplicity of robotic placement from the precision requirements of processing
2Reliability
If robotic arms transport carriers and process kit rings without retaining devices, then the system has simpler structure, but items may shift or fall during transportation causing damage
Solution Approach 1:
The retaining devices on the shelves automatically engage with carriers and process kit rings when they are placed on the shelves. The devices use passive mechanical means such as springs, latches, or friction surfaces to secure the items in place, eliminating the need for active control systems to continuously monitor and adjust item positions during transportation
Solution Approach 2:
The retaining devices are pre-configured on the shelves to prevent items from shifting or falling during transportation. By having the retention mechanism in place before transportation begins, the system proactively prevents potential damage rather than reacting to misalignment or falling items after they occur
3Manufacturing precision
If manual intervention is used to align and secure carriers and process kit rings, then alignment precision can be achieved, but processing time increases and automation is reduced
Solution Approach 1:
The alignment features on the shelves perform the alignment function automatically as carriers and process kit rings are placed on the shelves. The passive mechanical alignment features (such as tapered surfaces that guide orientation or grooves that position items) eliminate the need for manual alignment operations, achieving both high precision and fast processing speeds
Solution Approach 2:
The patent replaces manual mechanical alignment operations with automated passive mechanical alignment features built into the shelves. Instead of operators manually positioning and securing items, the shelves incorporate alignment features that automatically guide and secure items through mechanical means, maintaining precision while enabling automation
Data Source
AI summary
A shelf system includes a first distal portion configured to be fastened to a first surface of an enclosure system. The first distal portion includes a first carrier alignment feature and a first process kit ring alignment feature. The shelf system further includes a second distal portion configured to be fastened to a second surface of the enclosure system. The second distal portion includes a second carrier alignment feature and a second process kit ring alignment feature. The first carrier alignment feature and the second carrier alignment feature are configured to be disposed proximate outer surfaces of a carrier to align the carrier in the enclosure system. The first process kit ring alignment feature and the second process kit ring alignment feature are configured to be proximate inner surfaces of a process kit ring to align the process kit ring on the carrier in the enclosure system.