Storage Enclosure Sidewall Step for Expansion Module Integration
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Solution Overview
Problem
Storage array enclosures face challenges in maximizing data storage capacity within limited space without sacrificing the number of drive slots, while also requiring hot-swappable expansion modules that can be installed or removed without powering down the system and with minimal physical effort.
Innovation Solution
The enclosure design features a sidewall step that creates a cavity over the slide mounting region, allowing expansion modules to be located between the sidewall and data storage drives, with a circuit carrier extending from the backplane to the step to support these modules, enabling hot-swappable installation and maintenance without affecting drive count or space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the enclosure uses a uniform sidewall design, then the manufacturing is simple, but the storage capacity is reduced due to wasted space
Solution Approach 1:
The sidewall is segmented into two distinct portions: a first portion adjacent to the drive bays and a second portion adjacent to the expansion module bay. This segmentation allows each portion to be optimized for its specific function, with the first portion providing structural support for drives and the second portion creating the necessary cavity space for expansion modules, thereby maximizing storage capacity without compromising manufacturing simplicity
Solution Approach 2:
The invention introduces a vertical dimension variation in the sidewall design by creating a cavity through the second portion of the sidewall. This dimensional change allows the expansion module bay to be positioned at a different vertical level than the drive bays, effectively utilizing three-dimensional space within the enclosure to increase overall storage capacity while maintaining a relatively simple manufacturing process
2Quantity of substance
If expansion modules are integrated into the main enclosure body, then structural integrity is maintained, but drive slots and space utilization are reduced
Solution Approach 1:
The enclosure structure is segmented into distinct functional zones: drive bays for data storage drives and a separate expansion module bay for hot-swappable modules. The sidewall segmentation creates a cavity that houses expansion modules without encroaching on drive slot space, allowing both drive capacity and expansion functionality to be maximized simultaneously
Solution Approach 2:
The expansion module bay is nested within the enclosure structure by creating a cavity in the sidewall. This nested design allows expansion modules to be housed within the existing enclosure footprint without requiring additional external space or reducing the number of drive slots available for data storage drives
3Reliability
If the enclosure is designed for hot-swappable modules, then system availability is improved, but the structural design becomes more complex
Solution Approach 1:
The expansion module bay is extracted as a separate, accessible compartment within the enclosure by creating a cavity in the sidewall. This extraction allows expansion modules to be independently accessed, installed, and removed without affecting the main enclosure structure or requiring system shutdown, thereby improving system availability while keeping the overall design relatively simple
Solution Approach 2:
The cavity design creates a vertical dimensional separation between the expansion module bay and the drive bays. This dimensional change enables hot-swappable module access from the top of the enclosure without interfering with drive slot positioning or requiring complex structural modifications to the main enclosure body
Data Source
AI summary
An enclosure has a sidewall with a step that results in an upper part of the sidewall extending over a slide mounting region. A backplane is located at a base of the enclosure and is configured to receive a plurality of data storage drives. A circuit carrier extends from the backplane to the step in the side of the enclosure. The circuit carrier has one or more connectors proximate an upper surface of the step and is configured to receive one or more expansion modules that expand a functionality of the backplane.