Enclosure for Image Capture Systems with Solid State Die Focusing
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Solution Overview
Problem
Current image capture units lack auto-focusing capabilities and are vulnerable to electro-magnetic interference (EMI), which can cause misfocusing and errors, while also being costly and having a large footprint.
Innovation Solution
An enclosure or housing for an image capture system that includes a solid state die to provide focusing capabilities and serves as EMI shielding, electrically coupling the die to the image capture system and other circuitry, using electrodes to modulate the refractive index of the die for focal length adjustment and incorporating metal stiffeners for shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional image capture units are used, then manufacturing cost is high and footprint is large, but they lack auto-focusing capability and EMI shielding
Solution Approach 1:
The patent combines the EMI shielding function and auto-focusing functionality into a single integrated enclosure structure. The enclosure itself serves as both the protective shield against EMI and the mechanical structure that houses the focusing mechanism, eliminating the need for separate shielding components and reducing overall device complexity.
Solution Approach 2:
The enclosure is designed to perform multiple functions simultaneously: it provides EMI shielding, houses the imaging lens and sensor, and incorporates the auto-focusing mechanism. This multi-functional design reduces the number of separate components needed and simplifies the overall system architecture.
2Adaptability or versatility
If traditional image capture units are used, then structure is simple, but they lack auto-focusing capability and are vulnerable to EMI
Solution Approach 1:
The auto-focusing mechanism is integrated directly into the enclosure structure, merging the focusing functionality with the housing. This allows the system to gain auto-focusing capability without adding separate complex focusing mechanisms outside the enclosure.
Solution Approach 2:
The enclosure acts as an intermediary structure that incorporates both the EMI shielding and the auto-focusing mechanism. It mediates between the need for protection and the need for advanced functionality, providing both capabilities through its integrated design.
3Reliability
If EMI shielding is added to image capture units, then immunity to EMI is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The EMI shielding function is merged with the enclosure structure itself, eliminating the need for separate shielding components. This integration reduces the number of parts, simplifies assembly, and lowers manufacturing costs while maintaining EMI protection.
Solution Approach 2:
The enclosure serves as both the structural housing and the EMI shield, performing multiple functions with a single component. This multi-functionality reduces overall manufacturing complexity and cost while providing comprehensive EMI immunity.
4Adaptability or versatility
If advanced focusing capabilities are integrated into image capture units, then auto-focusing is achieved, but device footprint and complexity increase
Solution Approach 1:
The auto-focusing mechanism is merged with the enclosure structure, utilizing the existing housing space to accommodate the focusing components. This integration minimizes the additional footprint required while providing advanced focusing capabilities.
Solution Approach 2:
The focusing mechanism is designed to operate within the three-dimensional space of the enclosure, utilizing vertical and lateral dimensions efficiently. By arranging components in multiple dimensions rather than simply extending the footprint, the design achieves focusing capability without proportionally increasing the overall device volume.
Data Source
AI summary
Embodiments of the invention describe an enclosure for an image capture system that includes an image capture unit and a solid state die to provide focusing capabilities for a lens unit of the image capture unit. The enclosure may electrically couple the solid state die to the image capture unit and/or other system circuitry. The enclosure may further serve as EMI shielding for the image capture system.