Electronic Product Enclosure With Thermal Insulating Plate
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Solution Overview
Problem
Current SIM cards in vehicle-mounted electronic products face deformation and damage due to high ambient temperatures, which are exacerbated by temperature fluctuations, and existing cooling methods are insufficient to maintain a stable operating range.
Innovation Solution
An electronic product enclosure with a thermal insulating plate separating two chambers, one for the SIM card and another for a heating device, prevents heat transfer through convection, maintaining a stable temperature for the SIM card using through-holes for air circulation and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the SIM card is placed in a vehicle-mounted electronic product without thermal insulation, then the device can operate with simple structure, but the SIM card temperature exceeds 70 degrees Celsius causing deformation and damage
Solution Approach 1:
The enclosure is segmented into two independent chambers: a first chamber for the SIM card and a second chamber for the heating device. This segmentation physically separates the SIM card from heat-generating components, preventing thermal damage while maintaining structural simplicity through clear functional division.
Solution Approach 2:
A thermal insulating plate is introduced as an intermediary element between the first chamber (SIM card) and the second chamber (heating device). This insulating plate blocks heat transfer, allowing the heating device to operate without compromising SIM card temperature stability, thus resolving the contradiction between reliability and structural complexity.
2Temperature
If a thermal insulating plate is added to separate the SIM card from the heating device, then the SIM card temperature is stabilized, but the device structure becomes more complex
Solution Approach 1:
The enclosure is divided into two independent chambers with the thermal insulating plate forming a clear boundary. This segmentation approach stabilizes SIM card temperature by isolating it from heat sources, while the modular design keeps the structural complexity manageable through functional separation.
Solution Approach 2:
Thermal insulation is applied locally at the critical interface between the SIM card chamber and heating device chamber. The thermal insulating plate provides targeted temperature stabilization where needed most, rather than insulating the entire enclosure, thus balancing temperature control with structural simplicity.
3Strength
If the card base is changed from half-enclosed to fully enclosed to prevent deformation, then structural support is improved, but heat dissipation capability is reduced and temperature control is insufficient
Solution Approach 1:
The enclosure design segments the SIM card chamber from heat-generating components using a thermal insulating plate. This allows the card base to maintain a fully enclosed structure for structural strength while the insulation layer ensures adequate heat isolation, resolving the contradiction between structural support and temperature control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively stabilizes the ambient temperature of the SIM card, preventing deformation and damage by isolating it from heat produced by the heating device, ensuring reliable operation and performance.
Implementation Method 1
heat produced by a heating device seated in the second chamber cannot be transferred, through heat convection, to the first chamber
Implementation Method 2
a thermal insulating plate is placed between the first chamber and the second chamber
Data Source
AI summary
Embodiments of the present invention relate to communication accessory technologies, and provide an electronic product enclosure and an electronic product equipped with the electronic product enclosure to prevent an SIM card from risks of deformation and damage due to heating. In the embodiments of the present invention, the electronic product enclosure includes a first chamber configured to accommodate a user card and a second chamber configured to accommodate a heating device, where a thermal insulating plate is placed between the first chamber and the second chamber. The present invention is mainly applied in the field of communications.